XCVU11P-3FSGD2104E

XCVU11P-3FSGD2104E

Manufacturer No:

XCVU11P-3FSGD2104E

Manufacturer:

AMD

Description:

IC FPGA 572 I/O 2104FCBGA

Datasheet:

Datasheet

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XCVU11P-3FSGD2104E Specifications

  • Type
    Parameter
  • Packaging
    Tray
The XCVU11P-3FSGD2104E is a specific model of integrated circuit (IC) chip manufactured by Xilinx. It belongs to the Virtex UltraScale+ family of FPGAs (Field-Programmable Gate Arrays). Here are some advantages and application scenarios of this particular chip:Advantages: 1. High Performance: The XCVU11P-3FSGD2104E chip offers high-performance computing capabilities, making it suitable for demanding applications that require significant processing power. 2. Large Capacity: It has a large logic capacity, allowing for the implementation of complex designs and algorithms. 3. Versatility: The chip supports a wide range of applications due to its programmable nature, enabling users to customize its functionality according to their specific requirements. 4. Low Power Consumption: Despite its high performance, the chip is designed to be power-efficient, making it suitable for applications where power consumption is a concern. 5. High-Speed Interfaces: It supports various high-speed interfaces, such as PCIe (Peripheral Component Interconnect Express), enabling seamless integration with other devices and systems.Application Scenarios: 1. Data Centers: The XCVU11P-3FSGD2104E chip can be used in data centers for tasks like data processing, network acceleration, and machine learning, where high-performance computing is crucial. 2. High-Performance Computing (HPC): It is suitable for HPC applications like scientific simulations, weather forecasting, and computational fluid dynamics, where massive parallel processing is required. 3. Video Processing: The chip's high-performance capabilities make it ideal for video processing applications, such as video transcoding, real-time video analytics, and video encoding/decoding. 4. Aerospace and Defense: It can be used in aerospace and defense applications, including radar systems, signal processing, and communication systems, where high-speed data processing and low power consumption are essential. 5. Artificial Intelligence (AI): The XCVU11P-3FSGD2104E chip can be utilized in AI applications, such as deep learning, neural networks, and natural language processing, where high-performance computing and large logic capacity are critical.It's important to note that the specific application scenarios may vary depending on the requirements and design choices of the user.