XCVU9P-3FLGB2104E

XCVU9P-3FLGB2104E

Manufacturer No:

XCVU9P-3FLGB2104E

Manufacturer:

AMD

Description:

IC FPGA 702 I/O 2104FCBGA

Datasheet:

Datasheet

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XCVU9P-3FLGB2104E Specifications

  • Type
    Parameter
  • Packaging
    Tray
The XCVU9P-3FLGB2104E is a specific model of integrated circuit (IC) chip manufactured by Xilinx. It belongs to the Virtex UltraScale+ family of FPGAs (Field-Programmable Gate Arrays). Here are some advantages and application scenarios of this particular chip:Advantages: 1. High Performance: The XCVU9P-3FLGB2104E chip offers high-performance computing capabilities, making it suitable for demanding applications that require significant processing power. 2. Large Capacity: With a capacity of 2.5 million logic cells, this chip provides ample resources for complex designs and applications. 3. Versatility: The chip supports a wide range of I/O standards, making it compatible with various interfaces and protocols. 4. Programmability: Being an FPGA, the XCVU9P-3FLGB2104E chip is highly programmable, allowing users to customize its functionality according to their specific requirements. 5. Power Efficiency: The chip incorporates power optimization features, enabling efficient power consumption and reducing overall energy costs.Application Scenarios: 1. Data Centers: The high-performance computing capabilities of the XCVU9P-3FLGB2104E chip make it suitable for data center applications, such as data processing, machine learning, and artificial intelligence. 2. Communications: The chip's large capacity and versatility make it useful in communication systems, including wireless base stations, network switches, and routers. 3. Aerospace and Defense: The XCVU9P-3FLGB2104E chip can be employed in aerospace and defense applications, such as radar systems, signal processing, and secure communications. 4. High-Performance Computing: This chip is well-suited for applications that require significant computational power, such as scientific simulations, financial modeling, and image processing. 5. Video and Image Processing: The XCVU9P-3FLGB2104E chip's capabilities can be utilized in video and image processing applications, including video transcoding, real-time video analytics, and high-resolution image rendering.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and design considerations of each project.