XCVU13P-2FHGB2104E

XCVU13P-2FHGB2104E

Manufacturer No:

XCVU13P-2FHGB2104E

Manufacturer:

AMD

Description:

IC FPGA 702 I/O 2104FCBGA

Datasheet:

Datasheet

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XCVU13P-2FHGB2104E Specifications

  • Type
    Parameter
  • Packaging
    Tray
The XCVU13P-2FHGB2104E is a specific model of integrated circuit (IC) chip manufactured by Xilinx. It belongs to the Virtex UltraScale+ family of FPGAs (Field-Programmable Gate Arrays). Here are some advantages and application scenarios of this particular chip:Advantages: 1. High Performance: The XCVU13P-2FHGB2104E chip offers high-performance computing capabilities, making it suitable for demanding applications that require significant processing power. 2. Large Capacity: With a capacity of 13 million logic cells, this chip provides ample resources for complex designs and applications. 3. Versatility: Being an FPGA, the XCVU13P-2FHGB2104E offers flexibility in terms of reconfigurability. It allows users to modify the chip's functionality even after it has been manufactured, making it suitable for a wide range of applications. 4. High-Speed Interfaces: The chip supports various high-speed interfaces, such as PCIe Gen4, DDR4, and 100G Ethernet, enabling fast data transfer and communication.Application Scenarios: 1. Data Centers: The XCVU13P-2FHGB2104E chip can be used in data centers for tasks like data processing, network acceleration, and machine learning. Its high-performance computing capabilities and support for high-speed interfaces make it suitable for handling large amounts of data and complex computations. 2. High-Performance Computing: This chip can be utilized in applications that require high-performance computing, such as scientific simulations, financial modeling, and image processing. Its large capacity and high-speed interfaces enable efficient processing of complex algorithms and data sets. 3. Aerospace and Defense: The XCVU13P-2FHGB2104E chip can be employed in aerospace and defense systems for tasks like radar signal processing, image recognition, and communication systems. Its versatility and reconfigurability allow for customization and adaptation to specific requirements. 4. 5G and Networking: With its support for high-speed interfaces like 100G Ethernet, this chip can be used in 5G infrastructure, networking equipment, and telecommunications systems. It enables fast data transfer and processing, contributing to the efficient functioning of these systems.It's important to note that the specific application scenarios may vary depending on the requirements and design choices of the end-user.