XCVU23P-2VSVA1365I

XCVU23P-2VSVA1365I

Manufacturer No:

XCVU23P-2VSVA1365I

Manufacturer:

AMD

Description:

IC FPGA VIRTEX-UP 1365FCBGA

Datasheet:

Datasheet

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XCVU23P-2VSVA1365I Specifications

  • Type
    Parameter
  • Packaging
    Tray
The XCVU23P-2VSVA1365I is a specific model of integrated circuit (IC) chip manufactured by Xilinx. It belongs to the Virtex UltraScale+ family of FPGAs (Field-Programmable Gate Arrays). Here are some advantages and application scenarios of this particular chip:Advantages: 1. High Performance: The XCVU23P-2VSVA1365I chip offers high-performance capabilities, including a large number of logic cells, high-speed transceivers, and advanced DSP (Digital Signal Processing) capabilities. It is designed to handle complex and computationally intensive tasks efficiently.2. Programmability: Being an FPGA, the XCVU23P-2VSVA1365I chip is highly programmable. It allows users to configure the chip's functionality and logic circuits according to their specific requirements. This flexibility makes it suitable for a wide range of applications.3. Scalability: The Virtex UltraScale+ family of FPGAs, including the XCVU23P-2VSVA1365I chip, offers scalability options. It means that users can choose different models within the family based on their performance and resource requirements. This allows for easy migration and scalability of designs.Application Scenarios: 1. Data Centers: The high-performance capabilities of the XCVU23P-2VSVA1365I chip make it suitable for data center applications. It can be used for tasks like data processing, network acceleration, machine learning, and artificial intelligence. The programmability of the chip allows for customization based on specific data center requirements.2. High-Performance Computing (HPC): HPC applications, such as scientific simulations, weather forecasting, and cryptography, require significant computational power. The XCVU23P-2VSVA1365I chip's high-performance and programmability make it suitable for accelerating these computationally intensive tasks.3. Aerospace and Defense: The XCVU23P-2VSVA1365I chip's high-performance and scalability make it suitable for aerospace and defense applications. It can be used for radar and sonar processing, image and signal processing, communication systems, and other mission-critical tasks.4. Video and Image Processing: The advanced DSP capabilities of the XCVU23P-2VSVA1365I chip make it suitable for video and image processing applications. It can be used for tasks like video encoding/decoding, real-time video analytics, and high-resolution image processing.5. Communications and Networking: The high-speed transceivers and programmability of the XCVU23P-2VSVA1365I chip make it suitable for communications and networking applications. It can be used for tasks like packet processing, protocol acceleration, network security, and software-defined networking.It's important to note that the specific application scenarios may vary based on the requirements and design choices of the user.