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EP3CLS70F780I7 Specifications
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TypeParameter
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Supplier Device Package780-FBGA (29x29)
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Package / Case780-BGA
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Operating Temperature-40°C ~ 100°C (TJ)
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Mounting TypeSurface Mount
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Voltage - Supply1.15V ~ 1.25V
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Number of I/O413
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Total RAM Bits3068928
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Number of Logic Elements/Cells70208
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Number of LABs/CLBs4388
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesCyclone® III
The EP3CLS70F780I7 is an integrated circuit chip developed by Intel. It belongs to the Arria 10 family of field-programmable gate arrays (FPGAs) and offers several advantages and application scenarios:Advantages: 1. High Performance: The EP3CLS70F780I7 chip provides high-performance computing capabilities, making it suitable for demanding applications that require fast processing speeds. 2. Flexibility: Being an FPGA, it offers flexibility in terms of reconfigurability. Users can program the chip to perform specific tasks, making it adaptable to a wide range of applications. 3. Low Power Consumption: The chip is designed to be power-efficient, making it suitable for applications where energy consumption is a concern. 4. High-Speed Connectivity: It supports high-speed serial transceivers, enabling fast data transfer rates and connectivity options. 5. Security Features: The EP3CLS70F780I7 chip incorporates security features like secure boot and anti-tamper capabilities, making it suitable for applications that require robust security measures.Application Scenarios: 1. Data Centers: The high-performance computing capabilities of the EP3CLS70F780I7 chip make it suitable for data center applications, such as data processing, networking, and storage acceleration. 2. High-Frequency Trading: The chip's low latency and high-speed connectivity features make it ideal for high-frequency trading applications, where quick data processing and low-latency communication are crucial. 3. Aerospace and Defense: The EP3CLS70F780I7 chip's security features and high-performance computing make it suitable for aerospace and defense applications, such as radar systems, communication systems, and secure data processing. 4. Video Processing: The chip's high-performance computing capabilities can be utilized for video processing applications, such as video transcoding, real-time video analytics, and video streaming. 5. Internet of Things (IoT): The flexibility and low power consumption of the chip make it suitable for IoT applications, where it can be programmed to perform various tasks like sensor data processing, edge computing, and connectivity management.These are just a few examples of the advantages and application scenarios of the EP3CLS70F780I7 integrated circuit chip. Its versatility and high-performance capabilities make it suitable for a wide range of applications across various industries.
