EP3C80F780I7N

EP3C80F780I7N

Manufacturer No:

EP3C80F780I7N

Manufacturer:

Intel

Description:

IC FPGA 429 I/O 780FBGA

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

EP3C80F780I7N Specifications

  • Type
    Parameter
  • Supplier Device Package
    780-FBGA (29x29)
  • Package / Case
    780-BGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.15V ~ 1.25V
  • Number of I/O
    429
  • Total RAM Bits
    2810880
  • Number of Logic Elements/Cells
    81264
  • Number of LABs/CLBs
    5079
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Cyclone® III
The EP3C80F780I7N is an integrated circuit chip from the Cyclone III FPGA family, manufactured by Intel (formerly Altera). It offers several advantages and can be used in various application scenarios. Here are some of the advantages and application scenarios of the EP3C80F780I7N:Advantages: 1. High Performance: The EP3C80F780I7N chip provides high-performance capabilities with a maximum operating frequency of up to 400 MHz. It offers a balance between speed and power consumption.2. Programmable Logic: Being a Field-Programmable Gate Array (FPGA), it allows users to program and reconfigure the chip's logic functions according to their specific requirements. This flexibility makes it suitable for a wide range of applications.3. Large Capacity: The EP3C80F780I7N chip has a large logic capacity, with 80,000 logic elements (LEs) and 3,888 kilobits of embedded memory. This makes it suitable for complex designs that require a significant amount of logic and memory resources.4. Low Power Consumption: The chip is designed to be power-efficient, making it suitable for applications where power consumption is a critical factor.5. Rich Set of I/O Interfaces: The EP3C80F780I7N chip offers a wide range of I/O interfaces, including LVDS, differential signaling, and high-speed transceivers. This makes it suitable for applications that require high-speed data transfer and communication.Application Scenarios: 1. Digital Signal Processing (DSP): The EP3C80F780I7N chip can be used in DSP applications such as audio and video processing, image recognition, and filtering. Its high-performance capabilities and large logic capacity make it suitable for implementing complex algorithms.2. Communications: The chip's rich set of I/O interfaces and high-speed transceivers make it suitable for communication applications such as networking, wireless communication, and data transmission. It can be used to implement protocols, signal processing, and data encryption.3. Industrial Automation: The EP3C80F780I7N chip can be used in industrial automation applications such as control systems, robotics, and machine vision. Its programmable logic allows for customization and adaptation to specific automation requirements.4. Test and Measurement: The chip's high-performance capabilities and programmable logic make it suitable for test and measurement applications. It can be used to implement signal generation, data acquisition, and real-time analysis.5. Embedded Systems: The EP3C80F780I7N chip can be used in embedded systems where flexibility and customization are required. It can be used to implement various functions such as sensor interfacing, data processing, and control algorithms.Overall, the EP3C80F780I7N chip's advantages of high performance, programmability, large capacity, low power consumption, and rich I/O interfaces make it suitable for a wide range of applications in different industries.