EP3C55F780I7N

EP3C55F780I7N

Manufacturer No:

EP3C55F780I7N

Manufacturer:

Intel

Description:

IC FPGA 377 I/O 780FBGA

Datasheet:

Datasheet

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EP3C55F780I7N Specifications

  • Type
    Parameter
  • Supplier Device Package
    780-FBGA (29x29)
  • Package / Case
    780-BGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.15V ~ 1.25V
  • Number of I/O
    377
  • Total RAM Bits
    2396160
  • Number of Logic Elements/Cells
    55856
  • Number of LABs/CLBs
    3491
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Cyclone® III
The EP3C55F780I7N is an integrated circuit chip from the Cyclone III FPGA family, manufactured by Intel (formerly Altera). It offers several advantages and can be used in various application scenarios. Here are some of its key advantages and applications:Advantages: 1. High Performance: The EP3C55F780I7N chip provides high-speed performance with a maximum operating frequency of up to 400 MHz. It offers efficient logic utilization and supports complex digital designs.2. Low Power Consumption: This chip is designed to be power-efficient, making it suitable for applications where power consumption is a critical factor. It incorporates power-saving features like programmable power management and clock gating.3. Flexibility and Reconfigurability: Being a Field-Programmable Gate Array (FPGA), the EP3C55F780I7N chip allows for reprogramming and reconfiguration of its logic functions. This flexibility enables rapid prototyping, design iteration, and customization.4. Integration and Scalability: The chip integrates various components like programmable logic blocks, embedded memory, digital signal processing (DSP) blocks, and high-speed transceivers. It also supports scalability, allowing for the addition of more functionality as required.Application Scenarios: 1. Communications: The EP3C55F780I7N chip can be used in communication systems for tasks like protocol conversion, data encryption/decryption, and signal processing. Its high-speed transceivers make it suitable for applications involving high-speed data transmission.2. Industrial Automation: With its flexibility and high performance, this chip can be used in industrial automation systems for tasks like control and monitoring, motor control, and sensor interfacing. Its low power consumption is beneficial for energy-efficient industrial applications.3. Video and Image Processing: The EP3C55F780I7N chip can be utilized in video and image processing applications, such as video encoding/decoding, image recognition, and real-time video processing. Its high-speed performance and DSP blocks enable efficient processing of multimedia data.4. Embedded Systems: This chip can be integrated into embedded systems for various applications, including automotive electronics, medical devices, and consumer electronics. Its reconfigurability allows for adapting to changing requirements and adding custom functionality.5. Research and Development: The EP3C55F780I7N chip is commonly used in research and development projects, where its flexibility and high-performance capabilities are leveraged for prototyping and testing new designs and algorithms.Overall, the EP3C55F780I7N integrated circuit chip offers a combination of high performance, low power consumption, flexibility, and integration, making it suitable for a wide range of applications in different industries.