EP3C55F780C6

EP3C55F780C6

Manufacturer No:

EP3C55F780C6

Manufacturer:

Intel

Description:

IC FPGA 377 I/O 780FBGA

Datasheet:

Datasheet

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EP3C55F780C6 Specifications

  • Type
    Parameter
  • Supplier Device Package
    780-FBGA (29x29)
  • Package / Case
    780-BGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.15V ~ 1.25V
  • Number of I/O
    377
  • Total RAM Bits
    2396160
  • Number of Logic Elements/Cells
    55856
  • Number of LABs/CLBs
    3491
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Cyclone® III
The EP3C55F780C6 is an integrated circuit chip from the Cyclone III FPGA family, developed by Altera (now Intel). It offers several advantages and can be used in various application scenarios. Some of the advantages and application scenarios of the EP3C55F780C6 chip are:Advantages: 1. High Performance: The EP3C55F780C6 chip provides high-performance capabilities with a maximum operating frequency of up to 400 MHz. It offers fast processing and response times, making it suitable for applications that require real-time processing.2. Programmable Logic: Being a Field-Programmable Gate Array (FPGA), the EP3C55F780C6 chip allows for the reconfiguration of its logic circuits. This flexibility enables designers to implement custom logic functions and adapt the chip's behavior to specific application requirements.3. Low Power Consumption: The Cyclone III FPGA family, including the EP3C55F780C6 chip, is designed to be power-efficient. It incorporates power-saving features like programmable power management and clock gating, making it suitable for battery-powered or energy-conscious applications.4. Integration and Connectivity: The EP3C55F780C6 chip offers a wide range of integrated peripherals and interfaces, including high-speed transceivers, memory controllers, and general-purpose I/O pins. This integration simplifies system design and reduces the need for additional external components.Application Scenarios: 1. Digital Signal Processing (DSP): The EP3C55F780C6 chip's high-performance capabilities make it suitable for DSP applications like audio and video processing, image recognition, and filtering. Its programmable logic allows for the implementation of custom algorithms and signal processing functions.2. Communications and Networking: With its integrated high-speed transceivers and connectivity options, the EP3C55F780C6 chip can be used in applications related to communications and networking. It can be employed in the development of routers, switches, network interface cards, and other network equipment.3. Industrial Automation: The EP3C55F780C6 chip's low power consumption and integration features make it suitable for industrial automation applications. It can be used in programmable logic controllers (PLCs), motor control systems, robotics, and other automation systems.4. Test and Measurement Equipment: The EP3C55F780C6 chip's high-performance capabilities and reconfigurability make it suitable for test and measurement equipment. It can be used in oscilloscopes, logic analyzers, spectrum analyzers, and other measurement devices.5. Medical and Scientific Instruments: The EP3C55F780C6 chip's high-performance processing and integration features make it applicable in medical and scientific instruments. It can be used in medical imaging systems, laboratory equipment, and other scientific instruments that require real-time processing and data analysis.These are just a few examples of the advantages and application scenarios of the EP3C55F780C6 chip. Its flexibility, performance, and integration make it suitable for a wide range of applications across various industries.