5CEFA7F27I7

5CEFA7F27I7

Manufacturer No:

5CEFA7F27I7

Manufacturer:

Intel

Description:

IC FPGA 336 I/O 672FBGA

Datasheet:

Datasheet

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5CEFA7F27I7 Specifications

  • Type
    Parameter
  • Supplier Device Package
    672-FBGA (27x27)
  • Package / Case
    672-BGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.07V ~ 1.13V
  • Number of I/O
    336
  • Total RAM Bits
    7880704
  • Number of Logic Elements/Cells
    149500
  • Number of LABs/CLBs
    56480
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Cyclone® V E
The 5CEFA7F27I7 is an integrated circuit chip from the Cyclone V series of Field-Programmable Gate Arrays (FPGAs) developed by Intel. Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The 5CEFA7F27I7 chip offers high-speed processing capabilities, making it suitable for applications that require real-time data processing and high-performance computing. 2. Flexibility: Being an FPGA, it allows for reprogramming and reconfiguring the chip's logic and functionality even after deployment. This flexibility makes it ideal for prototyping and development of custom hardware solutions. 3. Low Power Consumption: The chip is designed to be power-efficient, making it suitable for battery-powered devices or applications where power consumption is a concern. 4. Integration: The 5CEFA7F27I7 chip integrates various components like digital signal processing (DSP) blocks, memory, and high-speed transceivers, enabling the implementation of complex systems on a single chip.Application Scenarios: 1. Communications: The chip's high-speed transceivers and processing capabilities make it suitable for applications in telecommunications, networking, and wireless communication systems. 2. Industrial Automation: The flexibility of FPGAs allows for the implementation of custom control systems, data acquisition, and signal processing in industrial automation applications. 3. Video and Image Processing: The high-performance computing capabilities of the chip make it suitable for video and image processing applications, such as video surveillance, medical imaging, and computer vision. 4. Aerospace and Defense: The chip's ability to handle real-time data processing, low power consumption, and integration of various components make it suitable for aerospace and defense applications, including radar systems, avionics, and secure communications.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and design choices made by the user.