EP3C55F780C7

EP3C55F780C7

Manufacturer No:

EP3C55F780C7

Manufacturer:

Intel

Description:

IC FPGA 377 I/O 780FBGA

Datasheet:

Datasheet

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EP3C55F780C7 Specifications

  • Type
    Parameter
  • Supplier Device Package
    780-FBGA (29x29)
  • Package / Case
    780-BGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.15V ~ 1.25V
  • Number of I/O
    377
  • Total RAM Bits
    2396160
  • Number of Logic Elements/Cells
    55856
  • Number of LABs/CLBs
    3491
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Cyclone® III
The EP3C55F780C7 is an integrated circuit chip from the Cyclone III FPGA family, developed by Altera (now Intel). It offers several advantages and can be used in various application scenarios. Some of the advantages and application scenarios of the EP3C55F780C7 chip are:Advantages: 1. High Performance: The EP3C55F780C7 chip provides high-performance capabilities with a maximum operating frequency of up to 400 MHz. It offers fast processing and efficient execution of complex tasks.2. Programmable Logic: Being a Field-Programmable Gate Array (FPGA), the EP3C55F780C7 chip allows for the reconfiguration of its internal logic circuits. This flexibility enables customization and adaptation to specific application requirements.3. Low Power Consumption: The chip is designed to be power-efficient, making it suitable for applications where energy consumption is a concern. It incorporates power-saving features and can dynamically adjust power usage based on the workload.4. Integrated Components: The EP3C55F780C7 chip integrates various components, including programmable logic blocks, memory elements, digital signal processing (DSP) blocks, and I/O interfaces. This integration simplifies the design process and reduces the need for external components.Application Scenarios: 1. Digital Signal Processing: The EP3C55F780C7 chip's DSP blocks and high-performance capabilities make it suitable for applications that require real-time signal processing, such as audio and video processing, image recognition, and communication systems.2. Industrial Automation: The chip's programmable logic and I/O interfaces make it well-suited for industrial automation applications. It can be used to implement control systems, monitor sensors, and interface with various industrial protocols.3. Communications: With its high-speed processing and integrated components, the EP3C55F780C7 chip can be used in communication systems, including wireless base stations, network routers, and data transmission equipment.4. Embedded Systems: The chip's low power consumption and flexibility make it suitable for embedded systems applications. It can be used in devices like medical equipment, automotive systems, and consumer electronics, where customization, performance, and power efficiency are crucial.5. Research and Development: The EP3C55F780C7 chip's reconfigurable nature and high-performance capabilities make it a valuable tool for research and development purposes. It can be used to prototype and test new algorithms, designs, and concepts in various fields.It's important to note that the EP3C55F780C7 chip's specific application suitability may vary based on the requirements and constraints of each project.