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10M50DAF672C7G

10M50DAF672C7G

Manufacturer No:

10M50DAF672C7G

Manufacturer:

Intel

Description:

IC FPGA 500 I/O 672FBGA

Datasheet:

Datasheet

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10M50DAF672C7G Specifications

  • Type
    Parameter
  • Supplier Device Package
    672-FBGA (27x27)
  • Package / Case
    672-BGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.15V ~ 1.25V
  • Number of I/O
    500
  • Total RAM Bits
    1677312
  • Number of Logic Elements/Cells
    50000
  • Number of LABs/CLBs
    3125
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    MAX® 10
The 10M50DAF672C7G is an integrated circuit chip from the MAX 10 FPGA family, manufactured by Intel. It offers several advantages and can be used in various application scenarios. Here are some of the advantages and application scenarios of the 10M50DAF672C7G:Advantages: 1. Programmability: The 10M50DAF672C7G is a Field-Programmable Gate Array (FPGA), which means it can be reprogrammed to perform different functions. This flexibility allows for customization and adaptability in various applications. 2. High Integration: The chip integrates a large number of logic elements, memory blocks, and digital signal processing (DSP) blocks. This high integration enables complex digital designs to be implemented on a single chip, reducing the need for external components. 3. Low Power Consumption: The 10M50DAF672C7G is designed to be power-efficient, making it suitable for battery-powered or low-power applications. 4. Small Form Factor: The chip comes in a compact package, making it suitable for space-constrained applications where size is a critical factor. 5. Rich I/O Options: The 10M50DAF672C7G provides a wide range of input/output options, including general-purpose I/O pins, high-speed transceivers, and various communication interfaces. This versatility allows for connectivity with external devices and peripherals.Application Scenarios: 1. Embedded Systems: The 10M50DAF672C7G can be used in embedded systems for various applications such as industrial automation, robotics, and IoT devices. Its programmability and integration make it suitable for implementing complex control and processing algorithms. 2. Communications: The chip's high-speed transceivers and communication interfaces make it suitable for applications in telecommunications, networking, and wireless communication systems. 3. Signal Processing: The 10M50DAF672C7G's DSP blocks and high-speed I/O make it suitable for applications that require real-time signal processing, such as audio/video processing, image recognition, and digital signal processing. 4. Test and Measurement: The chip's programmability and I/O capabilities make it suitable for test and measurement equipment, where it can be used for data acquisition, signal generation, and control functions. 5. Prototyping and Development: The 10M50DAF672C7G can be used as a prototyping platform for developing and testing new digital designs before moving to production. Its flexibility and reprogrammability allow for rapid iteration and design validation.These are just a few examples of the advantages and application scenarios of the 10M50DAF672C7G integrated circuit chips. The specific use case will depend on the requirements and needs of the application.
10M50DAF672C7G Relevant information