10M25DAF256I7P

10M25DAF256I7P

Manufacturer No:

10M25DAF256I7P

Manufacturer:

Intel

Description:

IC FPGA 178 I/O 256FBGA

Datasheet:

Datasheet

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10M25DAF256I7P Specifications

  • Type
    Parameter
  • Supplier Device Package
    256-FBGA (17x17)
  • Package / Case
    256-LBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.15V ~ 1.25V
  • Number of I/O
    178
  • Total RAM Bits
    691200
  • Number of Logic Elements/Cells
    25000
  • Number of LABs/CLBs
    1563
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    MAX® 10
The 10M25DAF256I7P integrated circuit (IC) chips are part of the MAX 10 FPGA family from Intel. These chips offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the 10M25DAF256I7P IC chips are:Advantages: 1. Programmability: The MAX 10 FPGA family chips are programmable, allowing users to configure the logic and functionality of the chip according to their specific requirements. 2. Low power consumption: These chips are designed to be power-efficient, making them suitable for applications where power consumption is a concern. 3. High integration: The 10M25DAF256I7P chips offer a high level of integration, combining various functions and features into a single chip. This integration reduces the need for external components and simplifies the overall system design. 4. Flexibility: The MAX 10 FPGA family chips provide flexibility in terms of I/O interfaces, memory options, and processing capabilities, enabling them to be used in a wide range of applications.Application Scenarios: 1. Industrial automation: The 10M25DAF256I7P chips can be used in industrial automation systems for tasks such as control and monitoring. Their programmability allows for customization based on specific industrial requirements. 2. Internet of Things (IoT): These chips can be utilized in IoT devices for sensor data processing, connectivity, and control functions. Their low power consumption makes them suitable for battery-powered IoT applications. 3. Communications: The 10M25DAF256I7P chips can be employed in communication systems for tasks like signal processing, protocol handling, and data encryption. Their high integration enables compact and efficient communication solutions. 4. Automotive electronics: These chips can find applications in automotive electronics, such as advanced driver-assistance systems (ADAS), infotainment systems, and engine control units (ECUs). Their programmability allows for adaptability to changing automotive requirements. 5. Medical devices: The 10M25DAF256I7P chips can be used in medical devices for tasks like signal processing, data acquisition, and control. Their low power consumption and integration make them suitable for portable and wearable medical devices.These are just a few examples of the advantages and application scenarios of the 10M25DAF256I7P IC chips. The versatility and programmability of these chips make them suitable for a wide range of applications across various industries.