EP4CE30F23C8

EP4CE30F23C8

Manufacturer No:

EP4CE30F23C8

Manufacturer:

Intel

Description:

IC FPGA 328 I/O 484FBGA

Datasheet:

Datasheet

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EP4CE30F23C8 Specifications

  • Type
    Parameter
  • Supplier Device Package
    484-FBGA (23x23)
  • Package / Case
    484-BGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.15V ~ 1.25V
  • Number of I/O
    328
  • Total RAM Bits
    608256
  • Number of Logic Elements/Cells
    28848
  • Number of LABs/CLBs
    1803
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Cyclone® IV E
The EP4CE30F23C8 is an integrated circuit chip from the Cyclone IV FPGA family, manufactured by Intel (formerly Altera). It offers several advantages and can be used in various application scenarios. Here are some of its key advantages and applications:Advantages: 1. High Performance: The EP4CE30F23C8 chip provides high-performance capabilities with a maximum operating frequency of up to 300 MHz. It offers a balance between power consumption and performance, making it suitable for a wide range of applications. 2. Programmability: Being a Field-Programmable Gate Array (FPGA), the chip allows for reprogramming and customization of its logic functions. This flexibility enables designers to implement complex digital systems and algorithms as per their requirements. 3. Integration: The EP4CE30F23C8 chip integrates various components like logic elements, memory blocks, and digital signal processing (DSP) blocks on a single chip. This integration reduces the need for external components, simplifies the design process, and saves board space. 4. Low Power Consumption: The chip is designed to be power-efficient, making it suitable for battery-powered or low-power applications. It offers power-saving features like clock gating and programmable power management options. 5. Cost-Effective: FPGAs like EP4CE30F23C8 provide a cost-effective solution compared to custom Application-Specific Integrated Circuits (ASICs) as they eliminate the need for expensive mask production and allow for design changes without additional manufacturing costs.Application Scenarios: 1. Digital Signal Processing (DSP): The EP4CE30F23C8 chip's DSP blocks and high-performance capabilities make it suitable for applications like audio and video processing, image recognition, and software-defined radio. 2. Communications: It can be used in communication systems for tasks like protocol conversion, encryption/decryption, data compression, and error correction. 3. Industrial Automation: The chip can be employed in industrial automation systems for tasks like motor control, sensor interfacing, and real-time control. 4. Embedded Systems: EP4CE30F23C8 can be used in embedded systems for functions like system control, data acquisition, and processing. 5. Internet of Things (IoT): With its low power consumption and integration capabilities, the chip can be utilized in IoT devices for sensor data processing, edge computing, and connectivity. 6. Test and Measurement: It can be used in test and measurement equipment for tasks like signal generation, data acquisition, and protocol analysis.These are just a few examples of the advantages and application scenarios of the EP4CE30F23C8 chip. Its versatility and programmability make it suitable for a wide range of digital system designs.