XCVU160-3FLGB2104E

XCVU160-3FLGB2104E

Manufacturer No:

XCVU160-3FLGB2104E

Manufacturer:

AMD

Description:

IC FPGA 702 I/O 2104FCBGA

Datasheet:

Datasheet

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XCVU160-3FLGB2104E Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Packaging
    Tray
The XCVU160-3FLGB2104E is a specific model of integrated circuit (IC) chip manufactured by Xilinx. It belongs to the Virtex UltraScale+ family of FPGAs (Field-Programmable Gate Arrays). Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The XCVU160-3FLGB2104E chip offers high-performance computing capabilities, making it suitable for demanding applications that require significant processing power. 2. Large Logic Capacity: With a logic capacity of 2.5 million system logic cells, this chip can handle complex designs and accommodate a large number of digital circuits. 3. Versatility: The chip supports a wide range of I/O standards, making it compatible with various interfaces and protocols. 4. Flexibility: Being an FPGA, the XCVU160-3FLGB2104E chip allows for reprogramming and reconfiguring the hardware after manufacturing, enabling flexibility in design iterations and updates. 5. Low Power Consumption: Despite its high performance, the chip is designed to be power-efficient, making it suitable for applications where power consumption is a concern.Application Scenarios: 1. High-Performance Computing: The XCVU160-3FLGB2104E chip can be used in applications that require intensive computational tasks, such as scientific simulations, data analytics, and machine learning. 2. Networking and Telecommunications: With its large logic capacity and support for various I/O standards, this chip can be utilized in networking equipment, routers, switches, and telecommunications infrastructure. 3. Video and Image Processing: The high-performance capabilities of the chip make it suitable for video and image processing applications, including video transcoding, real-time video analytics, and high-resolution image rendering. 4. Aerospace and Defense: The XCVU160-3FLGB2104E chip can be employed in aerospace and defense systems, such as radar systems, signal processing, and communication systems, where high-performance computing and flexibility are crucial. 5. Industrial Automation: The chip's versatility and reprogrammability make it suitable for industrial automation applications, including robotics, control systems, and real-time monitoring.It's important to note that the specific application scenarios may vary depending on the requirements and design considerations of each project.