XCVU190-2FLGC2104E

XCVU190-2FLGC2104E

Manufacturer No:

XCVU190-2FLGC2104E

Manufacturer:

AMD

Description:

IC FPGA 416 I/O 2104FCBGA

Datasheet:

Datasheet

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XCVU190-2FLGC2104E Specifications

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The XCVU190-2FLGC2104E is a high-performance integrated circuit chip developed by Xilinx. It belongs to the Virtex UltraScale+ family and offers several advantages and application scenarios:Advantages: 1. High Performance: The XCVU190-2FLGC2104E chip provides exceptional processing power and performance, making it suitable for demanding applications that require high-speed data processing, such as data centers, networking, and telecommunications. 2. Large Logic Capacity: With a logic capacity of 6.8 million system logic cells, this chip can handle complex designs and accommodate a large number of digital circuits, making it ideal for applications that require extensive logic resources. 3. High-Speed Interfaces: The chip supports various high-speed interfaces, including PCIe Gen4, 100G Ethernet, and Interlaken, enabling it to handle high-bandwidth data transfer and communication requirements. 4. Versatility: The XCVU190-2FLGC2104E chip supports a wide range of functions, including digital signal processing (DSP), embedded processing, and high-speed serial connectivity, making it suitable for diverse applications. 5. Energy Efficiency: Despite its high performance, the chip is designed to be energy-efficient, helping to reduce power consumption and operational costs.Application Scenarios: 1. Data Centers: The XCVU190-2FLGC2104E chip can be used in data centers for tasks like data processing, network acceleration, and artificial intelligence (AI) applications. Its high-performance capabilities and large logic capacity make it suitable for handling complex data center workloads. 2. Networking and Telecommunications: With its support for high-speed interfaces, the chip can be utilized in networking and telecommunications equipment, such as routers, switches, and base stations. It enables efficient data processing, high-bandwidth communication, and network acceleration. 3. High-Performance Computing (HPC): The XCVU190-2FLGC2104E chip can be employed in HPC applications, including scientific research, simulations, and data analysis. Its high-performance capabilities and large logic capacity allow for efficient parallel processing and acceleration of computationally intensive tasks. 4. Video and Image Processing: The chip's DSP capabilities make it suitable for video and image processing applications, such as video surveillance, medical imaging, and multimedia processing. It can handle complex algorithms and real-time processing requirements. 5. Aerospace and Defense: The XCVU190-2FLGC2104E chip can be used in aerospace and defense systems, including radar systems, communication systems, and avionics. Its high-performance processing and support for high-speed interfaces enable efficient data processing and communication in demanding environments.Overall, the XCVU190-2FLGC2104E chip offers high performance, versatility, and energy efficiency, making it suitable for a wide range of applications that require advanced processing capabilities and high-speed data transfer.