XCVU125-2FLVB1760E

XCVU125-2FLVB1760E

Manufacturer No:

XCVU125-2FLVB1760E

Manufacturer:

AMD

Description:

IC FPGA 702 I/O 1760FCBGA

Datasheet:

Datasheet

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XCVU125-2FLVB1760E Specifications

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The XCVU125-2FLVB1760E is a specific model of integrated circuit (IC) chip manufactured by Xilinx. It belongs to the Virtex UltraScale+ family of FPGAs (Field-Programmable Gate Arrays). Here are some advantages and application scenarios of this particular chip:Advantages: 1. High Performance: The XCVU125-2FLVB1760E chip offers high-performance computing capabilities, making it suitable for demanding applications that require significant processing power. 2. Large Logic Capacity: With a logic capacity of 1.97 million system logic cells, this chip provides ample resources for complex designs and applications. 3. Versatility: The FPGA architecture of the XCVU125-2FLVB1760E allows for reprogramming and reconfiguring the chip's functionality, making it adaptable to a wide range of applications. 4. High-Speed Interfaces: The chip supports various high-speed interfaces, such as PCIe Gen3, DDR4, and 100G Ethernet, enabling fast data transfer and communication. 5. Low Power Consumption: Despite its high performance, the XCVU125-2FLVB1760E chip is designed to be power-efficient, making it suitable for applications where power consumption is a concern.Application Scenarios: 1. Data Centers: The high-performance computing capabilities and support for high-speed interfaces make the XCVU125-2FLVB1760E chip suitable for data center applications, such as network acceleration, data processing, and machine learning. 2. Aerospace and Defense: The versatility and large logic capacity of the chip make it suitable for aerospace and defense applications, including radar and signal processing, image and video processing, and communication systems. 3. High-Performance Computing: The XCVU125-2FLVB1760E chip can be used in applications that require significant computational power, such as scientific simulations, financial modeling, and data analytics. 4. Communications: The chip's support for high-speed interfaces makes it suitable for applications in the telecommunications industry, including network switches, routers, and baseband processing. 5. Industrial Automation: The XCVU125-2FLVB1760E chip can be used in industrial automation applications, such as robotics, machine vision, and control systems, where high-performance computing and reconfigurability are required.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and design considerations of each project.