XC6VSX475T-2FFG1759E

XC6VSX475T-2FFG1759E

Manufacturer No:

XC6VSX475T-2FFG1759E

Manufacturer:

AMD

Description:

IC FPGA 840 I/O 1759FCBGA

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

XC6VSX475T-2FFG1759E Specifications

  • Type
    Parameter
  • Supplier Device Package
    1759-FCBGA (42.5x42.5)
  • Package / Case
    1759-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.95V ~ 1.05V
  • Number of I/O
    840
  • Total RAM Bits
    39223296
  • Number of Logic Elements/Cells
    476160
  • Number of LABs/CLBs
    37200
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Virtex®-6 SXT
The XC6VSX475T-2FFG1759E is a specific model of the Virtex-6 family of Field-Programmable Gate Array (FPGA) integrated circuit chips developed by Xilinx. These chips offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the XC6VSX475T-2FFG1759E are:Advantages: 1. High Performance: The Virtex-6 FPGA chips are known for their high-performance capabilities, offering fast processing speeds and low latency. This makes them suitable for applications that require real-time processing and high-speed data handling.2. Programmability: Being FPGAs, these chips are highly programmable, allowing users to configure the logic and functionality of the chip according to their specific requirements. This flexibility makes them suitable for a wide range of applications.3. Large Logic Capacity: The XC6VSX475T-2FFG1759E chip has a large logic capacity, meaning it can accommodate complex designs and handle a significant number of logic elements. This makes it suitable for applications that require extensive logic processing, such as digital signal processing, image processing, and high-performance computing.4. High-Speed Interfaces: The Virtex-6 FPGA chips support various high-speed interfaces, such as PCIe, Ethernet, and DDR3 memory interfaces. This enables seamless integration with other systems and peripherals, making them suitable for applications that require high-speed data transfer and communication.Application Scenarios: 1. Aerospace and Defense: The high-performance and programmable nature of the XC6VSX475T-2FFG1759E chips make them suitable for aerospace and defense applications. They can be used in radar systems, communication systems, signal processing, and encryption/decryption applications.2. Telecommunications: The large logic capacity and high-speed interfaces of these chips make them suitable for telecommunications applications. They can be used in baseband processing, wireless communication systems, network switches, and routers.3. High-Performance Computing: The XC6VSX475T-2FFG1759E chips can be used in high-performance computing applications, such as scientific simulations, data analytics, and machine learning. Their high-performance capabilities and programmability allow for efficient parallel processing and acceleration of computationally intensive tasks.4. Video and Image Processing: The large logic capacity and high-speed interfaces of these chips make them suitable for video and image processing applications. They can be used in video codecs, image recognition systems, video surveillance, and medical imaging.5. Industrial Automation: The XC6VSX475T-2FFG1759E chips can be used in industrial automation applications, such as robotics, motion control, and machine vision. Their high-performance capabilities and programmability enable real-time control and processing of complex automation systems.Overall, the XC6VSX475T-2FFG1759E chips offer high performance, programmability, and large logic capacity, making them suitable for a wide range of applications that require fast processing, high-speed interfaces, and flexibility in logic design.