XC6VSX475T-1FF1759I

XC6VSX475T-1FF1759I

Manufacturer No:

XC6VSX475T-1FF1759I

Manufacturer:

AMD

Description:

IC FPGA 840 I/O 1759FCBGA

Datasheet:

Datasheet

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XC6VSX475T-1FF1759I Specifications

  • Type
    Parameter
  • Supplier Device Package
    1759-FCBGA (42.5x42.5)
  • Package / Case
    1759-BBGA, FCBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.95V ~ 1.05V
  • Number of I/O
    840
  • Total RAM Bits
    39223296
  • Number of Logic Elements/Cells
    476160
  • Number of LABs/CLBs
    37200
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Virtex®-6 SXT
The XC6VSX475T-1FF1759I is a specific model of integrated circuit (IC) chip from Xilinx. It belongs to the Virtex-6 family of Field-Programmable Gate Arrays (FPGAs). Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The XC6VSX475T-1FF1759I chip offers high-speed processing capabilities, making it suitable for applications that require high-performance computing. 2. Flexibility: Being an FPGA, it is programmable and can be reconfigured to perform different tasks. This flexibility allows for customization and adaptability in various applications. 3. Large Logic Capacity: With a logic capacity of 475,000 logic cells, this chip can handle complex designs and accommodate a significant number of functions and features. 4. Integrated Features: The XC6VSX475T-1FF1759I chip includes various integrated features like high-speed serial transceivers, memory controllers, and digital signal processing (DSP) blocks, which enhance its functionality and performance.Application Scenarios: 1. Communications: The high-speed serial transceivers and large logic capacity of this chip make it suitable for applications in telecommunications, networking, and data communication systems. 2. Aerospace and Defense: The XC6VSX475T-1FF1759I chip's high performance and flexibility make it ideal for aerospace and defense applications, such as radar systems, avionics, and secure communications. 3. High-Performance Computing: With its high-speed processing capabilities, this chip can be used in applications that require intensive computations, such as scientific research, data analysis, and simulation. 4. Video and Image Processing: The integrated DSP blocks and large logic capacity of the chip enable it to handle complex video and image processing tasks, making it suitable for applications like video surveillance, medical imaging, and multimedia systems.It's important to note that the specific application scenarios may vary depending on the requirements and design considerations of the project.