XC6VSX475T-2FF1759C

XC6VSX475T-2FF1759C

Manufacturer No:

XC6VSX475T-2FF1759C

Manufacturer:

AMD

Description:

IC FPGA 840 I/O 1759FCBGA

Datasheet:

Datasheet

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XC6VSX475T-2FF1759C Specifications

  • Type
    Parameter
  • Supplier Device Package
    1759-FCBGA (42.5x42.5)
  • Package / Case
    1759-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.95V ~ 1.05V
  • Number of I/O
    840
  • Total RAM Bits
    39223296
  • Number of Logic Elements/Cells
    476160
  • Number of LABs/CLBs
    37200
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Virtex®-6 SXT
The XC6VSX475T-2FF1759C is a specific model of integrated circuit (IC) chip from Xilinx, which belongs to the Virtex-6 family of Field-Programmable Gate Arrays (FPGAs). Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The XC6VSX475T-2FF1759C offers high-speed processing capabilities, making it suitable for applications that require high-performance computing. 2. Large Logic Capacity: With a logic capacity of 475,000 logic cells, this chip can handle complex designs and accommodate a large number of functions and features. 3. Flexible and Reconfigurable: Being an FPGA, the XC6VSX475T-2FF1759C can be reprogrammed and reconfigured even after deployment, allowing for flexibility in design and adaptability to changing requirements. 4. Integrated Features: The chip includes various integrated features like high-speed serial transceivers, memory controllers, and digital signal processing (DSP) blocks, which can simplify the design process and reduce the need for additional components.Application Scenarios: 1. High-Performance Computing: The XC6VSX475T-2FF1759C can be used in applications that require intensive computational tasks, such as scientific simulations, data processing, and image/video processing. 2. Communications and Networking: With its high-speed serial transceivers and integrated features, this chip is suitable for applications in telecommunications, networking, and data centers, where high-speed data transmission and processing are crucial. 3. Aerospace and Defense: The XC6VSX475T-2FF1759C's performance and reconfigurability make it suitable for aerospace and defense applications, including radar systems, avionics, and secure communications. 4. Industrial Automation: This chip can be used in industrial automation systems, such as robotics, machine vision, and control systems, where real-time processing and high-speed data transfer are required. 5. Medical Imaging: The XC6VSX475T-2FF1759C's capabilities can be utilized in medical imaging applications, such as ultrasound, MRI, and CT scanners, where high-performance processing is needed for image reconstruction and analysis.It's important to note that the specific application of the XC6VSX475T-2FF1759C chip may vary depending on the requirements and design considerations of the project.