XCVU3P-2FFVC1517E

XCVU3P-2FFVC1517E

Manufacturer No:

XCVU3P-2FFVC1517E

Manufacturer:

AMD

Description:

IC FPGA 520 I/O 1517FCBGA

Datasheet:

Datasheet

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XCVU3P-2FFVC1517E Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Packaging
    Tray
The XCVU3P-2FFVC1517E is a specific model of integrated circuit (IC) chip developed by Xilinx. It belongs to the Virtex UltraScale+ family of FPGAs (Field-Programmable Gate Arrays). Here are some advantages and application scenarios of this particular chip:Advantages: 1. High Performance: The XCVU3P-2FFVC1517E chip offers high-performance capabilities, including high-speed processing, low latency, and high bandwidth. It is designed to handle complex and computationally intensive tasks efficiently.2. Programmability: Being an FPGA, the XCVU3P-2FFVC1517E chip is highly programmable. It allows users to configure the chip's logic and functionality according to their specific requirements. This flexibility makes it suitable for a wide range of applications.3. Scalability: The Virtex UltraScale+ family of FPGAs, including the XCVU3P-2FFVC1517E, offers scalability options. It means that users can choose different chip models within the family based on their performance and resource requirements, allowing for easy upgrades or downgrades.4. Power Efficiency: Xilinx has designed the Virtex UltraScale+ FPGAs with a focus on power efficiency. The XCVU3P-2FFVC1517E chip incorporates power optimization techniques, enabling it to deliver high performance while minimizing power consumption.Application Scenarios: 1. Data Centers: The high-performance capabilities of the XCVU3P-2FFVC1517E chip make it suitable for data center applications. It can be used for tasks like data processing, network acceleration, machine learning, and artificial intelligence.2. High-Performance Computing (HPC): HPC applications, such as scientific simulations, weather forecasting, and financial modeling, can benefit from the computational power and programmability of the XCVU3P-2FFVC1517E chip.3. Aerospace and Defense: The XCVU3P-2FFVC1517E chip's high-speed processing and low latency make it suitable for aerospace and defense applications. It can be used in radar systems, signal processing, image and video processing, and communication systems.4. 5G and Wireless Communications: The XCVU3P-2FFVC1517E chip's high bandwidth and programmability make it suitable for 5G and wireless communication systems. It can be used for baseband processing, beamforming, and signal modulation/demodulation.5. Automotive: The automotive industry can utilize the XCVU3P-2FFVC1517E chip for advanced driver-assistance systems (ADAS), autonomous driving, and in-vehicle infotainment systems.It's important to note that the specific application scenarios may vary based on the requirements and design choices of the end-user.