XC6VHX380T-3FFG1155C

XC6VHX380T-3FFG1155C

Manufacturer No:

XC6VHX380T-3FFG1155C

Manufacturer:

AMD

Description:

IC FPGA 440 I/O 1156FCBGA

Datasheet:

Datasheet

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XC6VHX380T-3FFG1155C Specifications

  • Type
    Parameter
  • Supplier Device Package
    1156-FCBGA (35x35)
  • Package / Case
    1156-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.95V ~ 1.05V
  • Number of I/O
    440
  • Total RAM Bits
    28311552
  • Number of Logic Elements/Cells
    382464
  • Number of LABs/CLBs
    29880
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Virtex®-6 HXT
The XC6VHX380T-3FFG1155C is a specific model of integrated circuit (IC) chip from Xilinx. It belongs to the Virtex-6 family of FPGAs (Field-Programmable Gate Arrays). Here are some advantages and application scenarios of this particular chip:Advantages: 1. High Performance: The XC6VHX380T-3FFG1155C offers high-speed processing capabilities, making it suitable for applications that require high-performance computing. 2. Large Capacity: With a capacity of 380,000 logic cells, this chip provides ample resources for complex designs and applications. 3. Flexibility: Being an FPGA, the XC6VHX380T-3FFG1155C offers reprogrammability, allowing users to modify and update the functionality of the chip as per their requirements. 4. Integration: The chip integrates various features like DSP (Digital Signal Processing) slices, memory blocks, and high-speed transceivers, enabling the implementation of diverse applications on a single device.Application Scenarios: 1. Aerospace and Defense: The high-performance and large capacity of the XC6VHX380T-3FFG1155C make it suitable for applications in aerospace and defense sectors, such as radar systems, signal processing, and communication systems. 2. High-Performance Computing: The chip's ability to handle complex computations and its large capacity make it suitable for applications in high-performance computing, including scientific research, data centers, and supercomputing. 3. Communications: The integrated high-speed transceivers in the XC6VHX380T-3FFG1155C make it suitable for applications in telecommunications, networking, and wireless communication systems. 4. Industrial Automation: The chip's flexibility and high-performance capabilities make it suitable for industrial automation applications, such as robotics, machine vision, and control systems. 5. Medical Imaging: The XC6VHX380T-3FFG1155C can be used in medical imaging applications, such as ultrasound, MRI, and CT scanners, where high-speed processing and large capacity are required for real-time image processing.It's important to note that the specific application scenarios may vary depending on the requirements and design considerations of each project.