XCVU3P-1FFVC1517E

XCVU3P-1FFVC1517E

Manufacturer No:

XCVU3P-1FFVC1517E

Manufacturer:

AMD

Description:

IC FPGA 520 I/O 1517FCBGA

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

XCVU3P-1FFVC1517E Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Packaging
    Tray
The XCVU3P-1FFVC1517E is a specific model of integrated circuit (IC) chip developed by Xilinx. It belongs to the Virtex UltraScale+ family of FPGAs (Field-Programmable Gate Arrays). Here are some advantages and application scenarios of this particular chip:Advantages: 1. High Performance: The XCVU3P-1FFVC1517E chip offers high-performance capabilities, including high-speed processing, low latency, and high bandwidth. It is designed to handle complex and computationally intensive tasks efficiently.2. Programmability: Being an FPGA, the XCVU3P-1FFVC1517E chip is highly programmable. It allows users to configure the chip's logic and functionality according to their specific requirements. This flexibility makes it suitable for a wide range of applications.3. Scalability: The Virtex UltraScale+ family of FPGAs, including the XCVU3P-1FFVC1517E chip, offers scalability options. It means that users can choose different chip models within the family based on their performance and resource requirements, allowing for easy upscaling or downscaling of designs.4. Power Efficiency: The XCVU3P-1FFVC1517E chip is designed to be power-efficient, ensuring optimal performance while minimizing power consumption. This feature is particularly important in applications where power efficiency is a priority.Application Scenarios: 1. Data Centers: The high-performance capabilities of the XCVU3P-1FFVC1517E chip make it suitable for data center applications. It can be used for tasks like data processing, network acceleration, and machine learning inference, where high-speed processing and low latency are crucial.2. Communications and Networking: The chip's programmability and scalability make it well-suited for communication and networking applications. It can be used for tasks like packet processing, protocol conversion, encryption/decryption, and network traffic management.3. Aerospace and Defense: The XCVU3P-1FFVC1517E chip's high-performance and power efficiency make it suitable for aerospace and defense applications. It can be used in radar systems, signal processing, image and video processing, and other computationally intensive tasks.4. High-Performance Computing: The chip's capabilities make it suitable for high-performance computing applications, such as scientific simulations, financial modeling, and data analytics. Its programmability allows for customization and optimization of algorithms and computations.5. Automotive: The XCVU3P-1FFVC1517E chip can be used in automotive applications, including advanced driver-assistance systems (ADAS), autonomous driving, and in-vehicle infotainment systems. Its high-performance and power efficiency are beneficial in these demanding applications.It's important to note that the specific application scenarios may vary based on the requirements and design choices of the user.