XC7VX550T-1FFG1927I

XC7VX550T-1FFG1927I

Manufacturer No:

XC7VX550T-1FFG1927I

Manufacturer:

AMD

Description:

IC FPGA 600 I/O 1927FCBGA

Datasheet:

Datasheet

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XC7VX550T-1FFG1927I Specifications

  • Type
    Parameter
  • Supplier Device Package
    1927-FCBGA (45x45)
  • Package / Case
    1924-BBGA, FCBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.97V ~ 1.03V
  • Number of I/O
    600
  • Total RAM Bits
    43499520
  • Number of Logic Elements/Cells
    554240
  • Number of LABs/CLBs
    43300
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Virtex®-7 XT
The XC7VX550T-1FFG1927I is a high-performance integrated circuit chip from Xilinx. It belongs to the Virtex-7 family of field-programmable gate arrays (FPGAs) and offers several advantages and application scenarios:Advantages: 1. High Performance: The XC7VX550T-1FFG1927I chip provides high-speed processing capabilities, making it suitable for applications that require complex computations and real-time data processing. 2. Large Logic Capacity: With a logic capacity of 2.8 million system gates, this chip can accommodate large and complex designs, making it suitable for applications that require extensive logic resources. 3. Flexible and Reconfigurable: Being an FPGA, the XC7VX550T-1FFG1927I chip is highly flexible and can be reprogrammed to implement different functionalities, allowing for design changes and updates without the need for hardware modifications. 4. High-Speed Serial Connectivity: The chip supports high-speed serial interfaces like PCIe, Gigabit Ethernet, and Serial RapidIO, enabling fast data transfer rates and communication between different components. 5. Low Power Consumption: Despite its high performance, the XC7VX550T-1FFG1927I chip is designed to be power-efficient, making it suitable for applications where power consumption is a concern.Application Scenarios: 1. Communications and Networking: The high-speed serial connectivity and large logic capacity of the XC7VX550T-1FFG1927I chip make it suitable for applications in telecommunications, networking, and data centers. It can be used for tasks like packet processing, protocol conversion, and high-speed data routing. 2. Aerospace and Defense: The chip's high performance and reconfigurability make it ideal for aerospace and defense applications. It can be used for radar and sonar signal processing, image and video processing, encryption and decryption, and other computationally intensive tasks. 3. High-Performance Computing: The XC7VX550T-1FFG1927I chip's large logic capacity and high-speed processing capabilities make it suitable for high-performance computing applications. It can be used for tasks like scientific simulations, data analytics, and machine learning. 4. Industrial Automation: The chip's flexibility and high-speed serial connectivity make it suitable for industrial automation applications. It can be used for tasks like real-time control, motor control, and sensor interfacing. 5. Medical Imaging: The XC7VX550T-1FFG1927I chip's high performance and large logic capacity make it suitable for medical imaging applications. It can be used for tasks like image reconstruction, signal processing, and real-time analysis in medical imaging devices.These are just a few examples of the advantages and application scenarios of the XC7VX550T-1FFG1927I chip. Its versatility and high-performance capabilities make it suitable for a wide range of applications in various industries.