XC7VX415T-3FFG1157E

XC7VX415T-3FFG1157E

Manufacturer No:

XC7VX415T-3FFG1157E

Manufacturer:

AMD

Description:

IC FPGA 600 I/O 1157FCBGA

Datasheet:

Datasheet

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XC7VX415T-3FFG1157E Specifications

  • Type
    Parameter
  • Supplier Device Package
    1157-FCBGA (35x35)
  • Package / Case
    1156-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.97V ~ 1.03V
  • Number of I/O
    600
  • Total RAM Bits
    32440320
  • Number of Logic Elements/Cells
    412160
  • Number of LABs/CLBs
    32200
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Virtex®-7 XT
The XC7VX415T-3FFG1157E is a high-performance integrated circuit chip from Xilinx. It belongs to the Virtex-7 family of field-programmable gate arrays (FPGAs) and offers several advantages and application scenarios:Advantages: 1. High Performance: The XC7VX415T-3FFG1157E chip provides high-speed processing capabilities, making it suitable for applications that require complex computations and real-time data processing. 2. Programmability: Being an FPGA, it offers the advantage of reprogrammability. Users can modify the chip's functionality even after deployment, allowing for flexibility and adaptability in various applications. 3. Large Logic Capacity: With a logic capacity of 415,000 logic cells, this chip can handle large and complex designs, making it suitable for applications that require extensive logic processing. 4. High-Speed Interfaces: The XC7VX415T-3FFG1157E chip supports various high-speed interfaces, such as PCIe, Ethernet, and DDR3 memory interfaces, enabling seamless integration with other components and systems. 5. Low Power Consumption: Despite its high performance, the chip is designed to consume low power, making it suitable for applications where power efficiency is crucial.Application Scenarios: 1. High-Performance Computing: The XC7VX415T-3FFG1157E chip's high-speed processing capabilities and large logic capacity make it ideal for applications in the field of high-performance computing. It can be used in areas like scientific simulations, data analytics, and signal processing. 2. Aerospace and Defense: The chip's reprogrammability and high-performance features make it suitable for aerospace and defense applications. It can be used in radar systems, communication systems, image processing, and encryption/decryption applications. 3. Telecommunications: The XC7VX415T-3FFG1157E chip's high-speed interfaces and processing capabilities make it suitable for telecommunications applications. It can be used in baseband processing, wireless communication systems, and network infrastructure equipment. 4. Industrial Automation: The chip's high-performance computing capabilities and low power consumption make it suitable for industrial automation applications. It can be used in robotics, machine vision systems, and control systems. 5. Medical Imaging: The chip's high-speed processing and large logic capacity make it suitable for medical imaging applications. It can be used in ultrasound imaging, computed tomography (CT) scanners, and magnetic resonance imaging (MRI) systems.These are just a few examples of the advantages and application scenarios of the XC7VX415T-3FFG1157E chip. Its versatility and high-performance features make it suitable for a wide range of applications that require complex computations, high-speed processing, and low power consumption.