XC6VLX550T-2FFG1759C

XC6VLX550T-2FFG1759C

Manufacturer No:

XC6VLX550T-2FFG1759C

Manufacturer:

AMD

Description:

IC FPGA 840 I/O 1759FCBGA

Datasheet:

Datasheet

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XC6VLX550T-2FFG1759C Specifications

  • Type
    Parameter
  • Supplier Device Package
    1759-FCBGA (42.5x42.5)
  • Package / Case
    1759-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.95V ~ 1.05V
  • Number of I/O
    840
  • Total RAM Bits
    23298048
  • Number of Logic Elements/Cells
    549888
  • Number of LABs/CLBs
    42960
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Virtex®-6 LXT
The XC6VLX550T-2FFG1759C is a high-performance integrated circuit chip from Xilinx. It belongs to the Virtex-6 family of field-programmable gate arrays (FPGAs) and offers several advantages and application scenarios:Advantages: 1. High Performance: The XC6VLX550T-2FFG1759C chip provides high-speed processing capabilities, making it suitable for applications that require complex computations and real-time data processing. 2. Large Logic Capacity: With a logic capacity of 550,000 logic cells, this chip can handle large and complex designs, making it suitable for applications that require extensive logic resources. 3. Flexible Design: Being an FPGA, the XC6VLX550T-2FFG1759C chip allows for flexible design modifications even after deployment. It can be reprogrammed to adapt to changing requirements or to fix bugs without the need for hardware changes. 4. Integrated Features: The chip includes various integrated features like high-speed serial transceivers, memory controllers, and digital signal processing (DSP) blocks, which enhance its versatility and enable the implementation of a wide range of applications. 5. Low Power Consumption: The XC6VLX550T-2FFG1759C chip is designed to be power-efficient, making it suitable for applications where power consumption is a critical factor.Application Scenarios: 1. High-Performance Computing: The XC6VLX550T-2FFG1759C chip can be used in applications that require high-performance computing, such as scientific simulations, data analytics, and financial modeling. 2. Communications and Networking: With its integrated high-speed serial transceivers, the chip is well-suited for applications in telecommunications, networking, and data centers, where high-speed data transmission and processing are crucial. 3. Aerospace and Defense: The XC6VLX550T-2FFG1759C chip's high-performance capabilities and low power consumption make it suitable for aerospace and defense applications, including radar systems, avionics, and secure communications. 4. Video and Image Processing: The chip's large logic capacity and integrated DSP blocks make it ideal for video and image processing applications, such as video surveillance, medical imaging, and multimedia processing. 5. Industrial Automation: The XC6VLX550T-2FFG1759C chip can be used in industrial automation systems, including robotics, machine vision, and control systems, where real-time processing and flexibility are required.Overall, the XC6VLX550T-2FFG1759C chip's high performance, flexibility, and integrated features make it suitable for a wide range of applications that require complex computations, high-speed processing, and low power consumption.