XC6VSX315T-3FFG1759C

XC6VSX315T-3FFG1759C

Manufacturer No:

XC6VSX315T-3FFG1759C

Manufacturer:

AMD

Description:

IC FPGA 720 I/O 1759FCBGA

Datasheet:

Datasheet

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XC6VSX315T-3FFG1759C Specifications

  • Type
    Parameter
  • Supplier Device Package
    1759-FCBGA (42.5x42.5)
  • Package / Case
    1759-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.95V ~ 1.05V
  • Number of I/O
    720
  • Total RAM Bits
    25952256
  • Number of Logic Elements/Cells
    314880
  • Number of LABs/CLBs
    24600
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Virtex®-6 SXT
The XC6VSX315T-3FFG1759C is a specific model of integrated circuit (IC) chip from Xilinx. It belongs to the Virtex-6 family of Field-Programmable Gate Arrays (FPGAs). Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The XC6VSX315T-3FFG1759C offers high-speed processing capabilities, making it suitable for applications that require high-performance computing. 2. Flexibility: Being an FPGA, it is programmable and can be reconfigured to perform different tasks. This flexibility allows for customization and adaptability in various applications. 3. Large Logic Capacity: With a logic capacity of 315,000 slices, this chip can handle complex designs and accommodate a significant number of logic elements. 4. Integrated Features: The XC6VSX315T-3FFG1759C includes various integrated features like DSP slices, memory blocks, and high-speed serial transceivers, which enhance its functionality and performance.Application Scenarios: 1. Communications: The high-speed serial transceivers and large logic capacity of this chip make it suitable for applications in telecommunications, networking, and data communication systems. 2. Aerospace and Defense: The XC6VSX315T-3FFG1759C can be used in radar systems, avionics, and military applications that require high-performance computing and signal processing capabilities. 3. High-Performance Computing: Due to its high-speed processing and large logic capacity, this chip can be utilized in applications that require intensive computations, such as scientific research, data analysis, and simulations. 4. Video and Image Processing: The integrated DSP slices and high-performance capabilities of this chip make it suitable for video and image processing applications, including video encoding/decoding, image recognition, and computer vision.It is important to note that the specific application scenarios may vary depending on the requirements and design considerations of a particular project.