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XC6VLX365T-3FFG1156C Specifications
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TypeParameter
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Supplier Device Package1156-FCBGA (35x35)
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Package / Case1156-BBGA, FCBGA
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Operating Temperature0°C ~ 85°C (TJ)
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Mounting TypeSurface Mount
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Voltage - Supply0.95V ~ 1.05V
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Number of I/O600
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Total RAM Bits15335424
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Number of Logic Elements/Cells364032
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Number of LABs/CLBs28440
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesVirtex®-6 LXT
The XC6VLX365T-3FFG1156C is a specific model of the Virtex-6 family of Field-Programmable Gate Array (FPGA) chips manufactured by Xilinx. These chips offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the XC6VLX365T-3FFG1156C are:Advantages: 1. High Performance: The XC6VLX365T-3FFG1156C FPGA chip offers high-performance computing capabilities, making it suitable for demanding applications that require complex calculations and data processing.2. Flexibility: Being a programmable chip, the XC6VLX365T-3FFG1156C allows users to configure and reconfigure its logic and functionality according to their specific requirements. This flexibility makes it suitable for a wide range of applications.3. Integration: The XC6VLX365T-3FFG1156C chip integrates various components and features, including configurable logic blocks, memory blocks, DSP slices, and high-speed serial transceivers. This integration simplifies the design process and reduces the need for external components.4. Scalability: The Virtex-6 family of FPGA chips, including the XC6VLX365T-3FFG1156C, offers scalability options, allowing users to choose the appropriate chip size and resources based on their application requirements. This scalability ensures efficient resource utilization and cost-effectiveness.Application Scenarios: 1. High-Performance Computing: The XC6VLX365T-3FFG1156C chip's high-performance capabilities make it suitable for applications that require intensive computations, such as scientific simulations, financial modeling, and data analytics.2. Digital Signal Processing (DSP): With its integrated DSP slices, the XC6VLX365T-3FFG1156C chip can be used in applications that involve real-time signal processing, such as wireless communication systems, audio/video processing, and radar systems.3. Embedded Systems: The flexibility and integration of the XC6VLX365T-3FFG1156C chip make it suitable for embedded system applications, including industrial automation, robotics, and automotive electronics. Its programmability allows for customization and adaptation to specific requirements.4. High-Speed Data Communication: The XC6VLX365T-3FFG1156C chip's high-speed serial transceivers enable it to be used in applications that require high-speed data communication, such as networking equipment, high-speed data acquisition systems, and high-performance computing clusters.Overall, the XC6VLX365T-3FFG1156C FPGA chip offers high performance, flexibility, integration, and scalability, making it suitable for a wide range of applications that require complex computations, signal processing, embedded systems, and high-speed data communication.
