XCKU095-1FFVB1760I

XCKU095-1FFVB1760I

Manufacturer No:

XCKU095-1FFVB1760I

Manufacturer:

AMD

Description:

IC FPGA 702 I/O 1760FCBGA

Datasheet:

Datasheet

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XCKU095-1FFVB1760I Specifications

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The XCKU095-1FFVB1760I is a specific model of the Xilinx Kintex UltraScale FPGA family. This integrated circuit chip offers several advantages and can be used in various application scenarios. Some of the advantages and application scenarios of the XCKU095-1FFVB1760I are:Advantages: 1. High-performance FPGA: The XCKU095-1FFVB1760I chip belongs to the Kintex UltraScale family, which offers high-performance FPGA capabilities. It provides a large number of programmable logic cells, high-speed transceivers, and advanced DSP capabilities, enabling complex and computationally intensive designs.2. Scalability: The Kintex UltraScale FPGAs are designed to be scalable, allowing users to choose the appropriate chip based on their specific requirements. The XCKU095-1FFVB1760I offers a good balance between performance and cost, making it suitable for a wide range of applications.3. Low power consumption: The UltraScale architecture incorporates power optimization techniques, allowing the XCKU095-1FFVB1760I to deliver high performance while minimizing power consumption. This makes it suitable for power-constrained applications where energy efficiency is crucial.4. High-speed interfaces: The XCKU095-1FFVB1760I chip supports various high-speed interfaces, including PCIe, Ethernet, DDR4 memory, and more. This makes it suitable for applications that require fast data transfer and communication, such as networking, telecommunications, and high-performance computing.Application Scenarios: 1. Data center acceleration: The XCKU095-1FFVB1760I can be used in data centers to accelerate computationally intensive tasks, such as machine learning, data analytics, and video processing. Its high-performance FPGA fabric and DSP capabilities enable efficient parallel processing and acceleration of these workloads.2. Wireless communication: The XCKU095-1FFVB1760I chip's high-speed transceivers and programmable logic make it suitable for wireless communication applications. It can be used in baseband processing, wireless protocol implementation, and signal processing tasks in wireless infrastructure equipment.3. Aerospace and defense: The XCKU095-1FFVB1760I's high-performance capabilities and low power consumption make it suitable for aerospace and defense applications. It can be used in radar systems, signal processing, software-defined radios, and other mission-critical applications.4. High-performance computing: The XCKU095-1FFVB1760I can be used in high-performance computing clusters for tasks such as scientific simulations, financial modeling, and data processing. Its parallel processing capabilities and high-speed interfaces enable efficient execution of these computationally intensive workloads.5. Industrial automation: The XCKU095-1FFVB1760I can be utilized in industrial automation systems for tasks like real-time control, image processing, and machine vision. Its high-performance FPGA fabric and DSP capabilities enable the implementation of complex algorithms and real-time processing.These are just a few examples of the advantages and application scenarios of the XCKU095-1FFVB1760I integrated circuit chip. Its versatility and high-performance capabilities make it suitable for a wide range of applications across various industries.