XC6VLX550T-1FFG1759C

XC6VLX550T-1FFG1759C

Manufacturer No:

XC6VLX550T-1FFG1759C

Manufacturer:

AMD

Description:

IC FPGA 840 I/O 1759FCBGA

Datasheet:

Datasheet

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XC6VLX550T-1FFG1759C Specifications

  • Type
    Parameter
  • Supplier Device Package
    1759-FCBGA (42.5x42.5)
  • Package / Case
    1759-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.95V ~ 1.05V
  • Number of I/O
    840
  • Total RAM Bits
    23298048
  • Number of Logic Elements/Cells
    549888
  • Number of LABs/CLBs
    42960
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Virtex®-6 LXT
The XC6VLX550T-1FFG1759C is a high-performance integrated circuit chip from Xilinx. It belongs to the Virtex-6 family of field-programmable gate arrays (FPGAs) and offers several advantages and application scenarios:Advantages: 1. High Performance: The XC6VLX550T-1FFG1759C chip provides high-speed processing capabilities, making it suitable for applications that require complex computations and real-time data processing. 2. Large Logic Capacity: With a logic capacity of 550,000 logic cells, this chip can handle large and complex designs, making it suitable for applications that require extensive logic resources. 3. Flexible and Reconfigurable: Being an FPGA, the XC6VLX550T-1FFG1759C chip is highly flexible and can be reprogrammed to implement different functionalities, allowing for easy customization and adaptability. 4. Integrated Features: The chip includes various integrated features like high-speed serial transceivers, memory controllers, and digital signal processing (DSP) blocks, which enhance its capabilities and reduce the need for external components.Application Scenarios: 1. High-Performance Computing: The XC6VLX550T-1FFG1759C chip can be used in applications that require high-performance computing, such as scientific simulations, data analytics, and image processing. 2. Communications and Networking: With its integrated high-speed serial transceivers, the chip is suitable for applications in telecommunications, networking, and data centers, where high-speed data transmission and processing are crucial. 3. Aerospace and Defense: The XC6VLX550T-1FFG1759C chip's high-performance capabilities and reconfigurability make it suitable for aerospace and defense applications, including radar systems, avionics, and secure communications. 4. Industrial Automation: The chip can be used in industrial automation applications, such as robotics, machine vision, and control systems, where real-time processing and high-speed I/O are required. 5. Medical Imaging: With its large logic capacity and integrated DSP blocks, the chip can be utilized in medical imaging applications, including ultrasound, MRI, and CT scanners, for real-time image processing and analysis.Overall, the XC6VLX550T-1FFG1759C chip's high performance, flexibility, and integrated features make it well-suited for a wide range of applications that require advanced processing capabilities and customization options.