XC7VX330T-1FF1157I

XC7VX330T-1FF1157I

Manufacturer No:

XC7VX330T-1FF1157I

Manufacturer:

AMD

Description:

IC FPGA 600 I/O 1157FCBGA

Datasheet:

Datasheet

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XC7VX330T-1FF1157I Specifications

  • Type
    Parameter
  • Supplier Device Package
    1157-FCBGA (35x35)
  • Package / Case
    1156-BBGA, FCBGA
  • Operating Temperature
    -40°C ~ 100°C
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.97V ~ 1.03V
  • Number of I/O
    600
  • Total RAM Bits
    27648000
  • Number of Logic Elements/Cells
    326400
  • Number of LABs/CLBs
    25500
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Virtex®-7 XT
The XC7VX330T-1FF1157I is a high-performance integrated circuit chip from Xilinx. It belongs to the Virtex-7 family of field-programmable gate arrays (FPGAs) and offers several advantages and application scenarios:Advantages: 1. High Performance: The XC7VX330T-1FF1157I chip provides high-speed processing capabilities, making it suitable for applications that require complex computations and real-time data processing. 2. Large Logic Capacity: With a logic capacity of 330,000 slices, this chip can accommodate large and complex designs, making it suitable for applications that require extensive logic resources. 3. High-Speed Serial Connectivity: It supports high-speed serial interfaces like PCIe Gen3, making it suitable for applications that require fast data transfer rates. 4. Flexible Design: Being an FPGA, the XC7VX330T-1FF1157I chip allows for flexible and customizable designs. It can be reprogrammed to implement different functionalities, making it suitable for a wide range of applications. 5. Low Power Consumption: Despite its high performance, this chip is designed to consume low power, making it suitable for applications where power efficiency is crucial.Application Scenarios: 1. Communications and Networking: The high-speed serial connectivity and large logic capacity of the XC7VX330T-1FF1157I chip make it suitable for applications in telecommunications, networking, and data centers. It can be used for tasks like packet processing, encryption/decryption, and protocol conversion. 2. High-Performance Computing: The chip's high-speed processing capabilities and large logic capacity make it suitable for applications in high-performance computing, such as scientific simulations, image processing, and data analytics. 3. Aerospace and Defense: The XC7VX330T-1FF1157I chip's high performance, low power consumption, and reprogrammability make it suitable for aerospace and defense applications. It can be used for tasks like radar signal processing, software-defined radios, and avionics systems. 4. Industrial Automation: The chip's high-speed processing and flexible design make it suitable for industrial automation applications. It can be used for tasks like machine vision, motion control, and real-time monitoring. 5. Medical Imaging: The XC7VX330T-1FF1157I chip's high performance and large logic capacity make it suitable for medical imaging applications, such as ultrasound, MRI, and CT scanners.These are just a few examples of the advantages and application scenarios of the XC7VX330T-1FF1157I chip. Its versatility and capabilities make it suitable for a wide range of high-performance and data-intensive applications.