XC7K410T-3FFG900E

XC7K410T-3FFG900E

Manufacturer No:

XC7K410T-3FFG900E

Manufacturer:

AMD

Description:

IC FPGA 500 I/O 900FCBGA

Datasheet:

Datasheet

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XC7K410T-3FFG900E Specifications

  • Type
    Parameter
  • Supplier Device Package
    900-FCBGA (31x31)
  • Package / Case
    900-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.97V ~ 1.03V
  • Number of I/O
    500
  • Total RAM Bits
    29306880
  • Number of Logic Elements/Cells
    406720
  • Number of LABs/CLBs
    31775
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Kintex®-7
The XC7K410T-3FFG900E is a specific model of integrated circuit chip from Xilinx, which belongs to the Kintex-7 family of Field-Programmable Gate Arrays (FPGAs). Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The XC7K410T-3FFG900E chip offers high-performance processing capabilities, making it suitable for demanding applications that require fast and efficient data processing. 2. Programmability: Being an FPGA, this chip is programmable, allowing users to customize its functionality according to their specific requirements. This flexibility makes it suitable for a wide range of applications. 3. Large Logic Capacity: The XC7K410T-3FFG900E chip has a large logic capacity, which means it can accommodate complex designs and handle a significant number of logic elements. 4. Low Power Consumption: Despite its high performance, this chip is designed to consume low power, making it energy-efficient and suitable for applications where power consumption is a concern. 5. High-Speed Interfaces: The XC7K410T-3FFG900E chip supports various high-speed interfaces, such as PCIe, DDR3, and Ethernet, enabling seamless integration with other systems and devices.Application Scenarios: 1. Communications and Networking: The high-performance and programmable nature of the XC7K410T-3FFG900E chip make it suitable for applications in the communications and networking domain. It can be used for tasks like packet processing, protocol conversion, and network acceleration. 2. Aerospace and Defense: The chip's high-performance processing capabilities and low power consumption make it suitable for aerospace and defense applications. It can be used for tasks like radar signal processing, image and video processing, and encryption/decryption. 3. High-Performance Computing: The XC7K410T-3FFG900E chip's large logic capacity and high-speed interfaces make it suitable for high-performance computing applications. It can be used for tasks like data analytics, scientific simulations, and real-time processing. 4. Industrial Automation: This chip can be used in industrial automation applications, such as robotics, machine vision, and control systems. Its programmability allows for customization and adaptation to specific automation requirements. 5. Medical Imaging: The XC7K410T-3FFG900E chip's high-performance processing capabilities and support for high-speed interfaces make it suitable for medical imaging applications. It can be used for tasks like image reconstruction, signal processing, and real-time analysis.These are just a few examples of the advantages and application scenarios of the XC7K410T-3FFG900E chip. Its versatility and programmability make it suitable for a wide range of applications across various industries.