XC7VX330T-2FFG1157C

XC7VX330T-2FFG1157C

Manufacturer No:

XC7VX330T-2FFG1157C

Manufacturer:

AMD

Description:

IC FPGA 600 I/O 1157FCBGA

Datasheet:

Datasheet

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XC7VX330T-2FFG1157C Specifications

  • Type
    Parameter
  • Supplier Device Package
    1157-FCBGA (35x35)
  • Package / Case
    1156-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.97V ~ 1.03V
  • Number of I/O
    600
  • Total RAM Bits
    27648000
  • Number of Logic Elements/Cells
    326400
  • Number of LABs/CLBs
    25500
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Virtex®-7 XT
The XC7VX330T-2FFG1157C is a specific model of integrated circuit (IC) chip from Xilinx. It belongs to the Virtex-7 family of FPGAs (Field-Programmable Gate Arrays). Here are some advantages and application scenarios of this particular chip:Advantages: 1. High Performance: The XC7VX330T-2FFG1157C offers high-speed processing capabilities, making it suitable for applications that require high-performance computing. 2. Large Logic Capacity: With a logic capacity of 330,000 logic cells, this chip can handle complex designs and accommodate a large number of functions. 3. Versatility: The Virtex-7 family of FPGAs, including this chip, provides a wide range of features and resources, such as high-speed serial transceivers, DSP slices, and memory blocks, making it versatile for various applications. 4. Low Power Consumption: Despite its high performance, the XC7VX330T-2FFG1157C is designed to be power-efficient, making it suitable for applications where power consumption is a concern.Application Scenarios: 1. Communications: The high-speed serial transceivers and large logic capacity of this chip make it suitable for applications in the communications industry, such as wireless base stations, network switches, and routers. 2. Aerospace and Defense: The XC7VX330T-2FFG1157C can be used in aerospace and defense applications, including radar systems, avionics, and military communication systems, where high-performance computing and reliability are crucial. 3. High-Performance Computing: This chip can be utilized in applications that require high-performance computing, such as scientific research, data centers, and supercomputing, due to its high-speed processing capabilities and large logic capacity. 4. Video and Image Processing: The XC7VX330T-2FFG1157C can be employed in video and image processing applications, including video surveillance systems, medical imaging, and broadcasting equipment, where real-time processing and high-speed data transfer are essential.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and design considerations of a particular project.