XC7VX330T-1FFG1157C

XC7VX330T-1FFG1157C

Manufacturer No:

XC7VX330T-1FFG1157C

Manufacturer:

AMD

Description:

IC FPGA 600 I/O 1157FCBGA

Datasheet:

Datasheet

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XC7VX330T-1FFG1157C Specifications

  • Type
    Parameter
  • Supplier Device Package
    1157-FCBGA (35x35)
  • Package / Case
    1156-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.97V ~ 1.03V
  • Number of I/O
    600
  • Total RAM Bits
    27648000
  • Number of Logic Elements/Cells
    326400
  • Number of LABs/CLBs
    25500
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Virtex®-7 XT
The XC7VX330T-1FFG1157C is a high-performance integrated circuit chip from Xilinx. It belongs to the Virtex-7 family of field-programmable gate arrays (FPGAs) and offers several advantages and application scenarios. Some of them are:1. High-performance computing: The XC7VX330T-1FFG1157C chip provides high-speed processing capabilities, making it suitable for applications that require intensive computational tasks. It can handle complex algorithms, data processing, and signal processing efficiently.2. Reconfigurability: Being an FPGA, the XC7VX330T-1FFG1157C chip is highly reconfigurable. It allows users to modify the hardware functionality even after deployment, enabling flexibility and adaptability in various applications.3. Parallel processing: FPGAs excel in parallel processing tasks, and the XC7VX330T-1FFG1157C is no exception. It can perform multiple operations simultaneously, making it ideal for applications that require high throughput and parallel computing, such as image and video processing, cryptography, and data analytics.4. High-speed interfaces: The XC7VX330T-1FFG1157C chip supports various high-speed interfaces like PCIe, Ethernet, and DDR3/DDR4 memory interfaces. This makes it suitable for applications that require fast data transfer rates, such as networking equipment, high-speed data acquisition systems, and high-performance computing clusters.5. Aerospace and defense: The XC7VX330T-1FFG1157C chip's high-performance capabilities and reconfigurability make it well-suited for aerospace and defense applications. It can be used in radar systems, communication systems, avionics, and military-grade equipment that require real-time processing, high reliability, and adaptability.6. Scientific research: The chip's computational power and parallel processing capabilities make it valuable in scientific research applications. It can be used in fields like bioinformatics, computational physics, weather forecasting, and simulations, where complex calculations and data processing are required.7. Industrial automation: The XC7VX330T-1FFG1157C chip can be utilized in industrial automation systems, including robotics, machine vision, and control systems. Its high-speed processing and reconfigurability enable real-time control and efficient data processing in industrial environments.Overall, the XC7VX330T-1FFG1157C chip's advantages of high performance, reconfigurability, parallel processing, and support for high-speed interfaces make it suitable for a wide range of applications in various industries.