XC7K410T-3FBG676E

XC7K410T-3FBG676E

Manufacturer No:

XC7K410T-3FBG676E

Manufacturer:

AMD

Description:

IC FPGA 400 I/O 676FCBGA

Datasheet:

Datasheet

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XC7K410T-3FBG676E Specifications

  • Type
    Parameter
  • Supplier Device Package
    676-FCBGA (27x27)
  • Package / Case
    676-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.97V ~ 1.03V
  • Number of I/O
    400
  • Total RAM Bits
    29306880
  • Number of Logic Elements/Cells
    406720
  • Number of LABs/CLBs
    31775
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Kintex®-7
The XC7K410T-3FBG676E is a specific model of the Xilinx Kintex-7 family of field-programmable gate array (FPGA) integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance FPGA: The Kintex-7 family is known for its high-performance capabilities, making it suitable for demanding applications that require fast processing and high-speed data transfer. 2. Large logic capacity: The XC7K410T-3FBG676E chip has a large logic capacity, allowing for the implementation of complex digital designs and algorithms. 3. Low power consumption: Despite its high performance, the Kintex-7 family is designed to be power-efficient, making it suitable for applications where power consumption is a concern. 4. Versatile I/O capabilities: The chip offers a wide range of I/O options, including high-speed serial interfaces, making it suitable for applications that require interfacing with various external devices and protocols. 5. Advanced DSP capabilities: The Kintex-7 family includes dedicated digital signal processing (DSP) blocks, which can be utilized for applications such as image and video processing, wireless communication, and signal analysis.Application scenarios: 1. Communications and networking: The XC7K410T-3FBG676E chip can be used in applications such as routers, switches, and network interface cards, where high-speed data processing and low latency are crucial. 2. Aerospace and defense: The high-performance and low power consumption of the chip make it suitable for aerospace and defense applications, including radar systems, avionics, and secure communication systems. 3. High-performance computing: The large logic capacity and high-speed capabilities of the chip make it suitable for applications in the field of high-performance computing, such as data centers, scientific research, and simulations. 4. Industrial automation: The chip can be used in industrial automation systems, including robotics, machine vision, and control systems, where real-time processing and high-speed I/O are required. 5. Medical imaging: The advanced DSP capabilities of the chip make it suitable for medical imaging applications, such as ultrasound, MRI, and CT scanners, where real-time signal processing and high-speed data transfer are essential.These are just a few examples of the advantages and application scenarios of the XC7K410T-3FBG676E chip. The versatility and high-performance capabilities of the Kintex-7 family make it suitable for a wide range of applications in various industries.