XC7K325T-L2FFG900I

XC7K325T-L2FFG900I

Manufacturer No:

XC7K325T-L2FFG900I

Manufacturer:

AMD

Description:

IC FPGA 500 I/O 900FCBGA

Datasheet:

Datasheet

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XC7K325T-L2FFG900I Specifications

  • Type
    Parameter
  • Supplier Device Package
    900-FCBGA (31x31)
  • Package / Case
    900-BBGA, FCBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.97V ~ 1.03V
  • Number of I/O
    500
  • Total RAM Bits
    16404480
  • Number of Logic Elements/Cells
    326080
  • Number of LABs/CLBs
    25475
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Kintex®-7
The XC7K325T-L2FFG900I is a specific model of the Xilinx Kintex-7 family of field-programmable gate array (FPGA) integrated circuit chips. These chips offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the XC7K325T-L2FFG900I are:Advantages: 1. High Performance: The Kintex-7 FPGA family provides high-performance capabilities, making it suitable for demanding applications that require fast processing speeds and low latency. 2. Programmability: Being an FPGA, the XC7K325T-L2FFG900I can be reprogrammed to implement different functionalities, allowing for flexibility and adaptability in various applications. 3. Integration: The chip integrates a large number of programmable logic cells, memory blocks, and DSP slices, enabling the implementation of complex digital systems on a single chip. 4. Low Power Consumption: The Kintex-7 FPGAs are designed to be power-efficient, making them suitable for applications where power consumption is a concern. 5. High-Speed Interfaces: The XC7K325T-L2FFG900I supports various high-speed interfaces such as PCIe, Ethernet, and DDR3 memory, enabling connectivity with other devices and systems.Application Scenarios: 1. Communications: The high-performance and integration capabilities of the XC7K325T-L2FFG900I make it suitable for applications in the communications industry, such as wireless base stations, network switches, and routers. 2. Aerospace and Defense: The chip's programmability and high-speed interfaces make it useful in aerospace and defense applications, including radar systems, avionics, and secure communication systems. 3. High-Performance Computing: The XC7K325T-L2FFG900I can be used in high-performance computing applications, such as data centers, supercomputers, and scientific research, where fast processing and low latency are crucial. 4. Industrial Automation: The chip's integration and programmability make it suitable for industrial automation applications, including robotics, machine vision systems, and control systems. 5. Medical Imaging: The XC7K325T-L2FFG900I can be utilized in medical imaging devices like ultrasound machines, CT scanners, and MRI systems, where high-performance processing and real-time image processing are required.These are just a few examples of the advantages and application scenarios of the XC7K325T-L2FFG900I. The versatility and capabilities of the chip make it applicable in various industries and domains where high-performance, programmability, and integration are essential.