XC6VLX130T-2FF1156I

XC6VLX130T-2FF1156I

Manufacturer No:

XC6VLX130T-2FF1156I

Manufacturer:

AMD

Description:

IC FPGA 600 I/O 1156FCBGA

Datasheet:

Datasheet

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XC6VLX130T-2FF1156I Specifications

  • Type
    Parameter
  • Supplier Device Package
    1156-FCBGA (35x35)
  • Package / Case
    1156-BBGA, FCBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.95V ~ 1.05V
  • Number of I/O
    600
  • Total RAM Bits
    9732096
  • Number of Logic Elements/Cells
    128000
  • Number of LABs/CLBs
    10000
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Virtex®-6 LXT
The XC6VLX130T-2FF1156I is a specific model of integrated circuit (IC) chip from Xilinx, which belongs to the Virtex-6 family of Field-Programmable Gate Arrays (FPGAs). Here are some advantages and application scenarios of this particular chip:Advantages: 1. High Logic Density: The XC6VLX130T-2FF1156I chip offers a high logic capacity, allowing for the implementation of complex digital designs. It contains 130,000 logic cells, which can be used to create intricate circuits and systems.2. High-Speed Performance: This chip supports high-speed operation, making it suitable for applications that require fast data processing and high-performance computing. It offers advanced features like high-speed serial transceivers, dedicated DSP slices, and efficient memory interfaces.3. Flexibility and Reconfigurability: Being an FPGA, the XC6VLX130T-2FF1156I chip is highly flexible and reconfigurable. It allows users to program and reprogram the chip's functionality according to their specific requirements, even after deployment. This flexibility makes it suitable for prototyping, development, and applications that require frequent design iterations.4. Integration Capabilities: The XC6VLX130T-2FF1156I chip integrates various components and features, such as configurable I/Os, memory controllers, clock management resources, and embedded processors. This integration simplifies system design and reduces the need for external components, saving board space and cost.Application Scenarios: 1. High-Performance Computing: The XC6VLX130T-2FF1156I chip's high logic density and speed make it suitable for applications like data centers, scientific computing, and signal processing, where massive parallel processing and high-speed data transfer are required.2. Communications and Networking: With its high-speed serial transceivers and configurable I/Os, this chip can be used in networking equipment, routers, switches, and communication systems. It enables the implementation of various protocols and interfaces, such as Ethernet, PCIe, USB, and optical communication.3. Aerospace and Defense: The XC6VLX130T-2FF1156I chip's performance, flexibility, and integration capabilities make it suitable for aerospace and defense applications. It can be used in radar systems, avionics, satellite communication, and military-grade equipment, where reliability, high-speed processing, and adaptability are crucial.4. Industrial Automation: This chip can be employed in industrial automation systems, including robotics, machine vision, motion control, and factory automation. Its reconfigurability allows for customization and adaptation to different manufacturing processes and control algorithms.5. Prototyping and Development: The XC6VLX130T-2FF1156I chip is often used in prototyping and development stages of various electronic systems. Its flexibility allows designers to quickly test and validate their designs before moving to production, reducing time-to-market and development costs.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and context of the project.