XC7K410T-L2FBG676E

XC7K410T-L2FBG676E

Manufacturer No:

XC7K410T-L2FBG676E

Manufacturer:

AMD

Description:

IC FPGA 400 I/O 676FCBGA

Datasheet:

Datasheet

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XC7K410T-L2FBG676E Specifications

  • Type
    Parameter
  • Supplier Device Package
    676-FCBGA (27x27)
  • Package / Case
    676-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.97V ~ 1.03V
  • Number of I/O
    400
  • Total RAM Bits
    29306880
  • Number of Logic Elements/Cells
    406720
  • Number of LABs/CLBs
    31775
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Kintex®-7
The XC7K410T-L2FBG676E is a specific model of the Xilinx Kintex-7 family of field-programmable gate array (FPGA) integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance FPGA: The Kintex-7 family is known for its high-performance capabilities, offering a balance between power efficiency and processing power. The XC7K410T-L2FBG676E chip is specifically designed to provide high-speed processing and low power consumption.2. Large capacity: This chip has a large capacity with 410,000 logic cells, making it suitable for complex and demanding applications that require significant computational resources.3. Versatile I/O capabilities: The XC7K410T-L2FBG676E chip offers a wide range of I/O options, including high-speed serial transceivers, configurable I/O standards, and support for various communication protocols. This makes it suitable for applications that require interfacing with different devices and communication interfaces.4. Advanced DSP capabilities: The Kintex-7 family includes dedicated digital signal processing (DSP) blocks, which enable efficient implementation of complex mathematical algorithms. This makes the XC7K410T-L2FBG676E chip suitable for applications that involve signal processing, such as wireless communication, image processing, and audio/video processing.Application scenarios: 1. Communications and networking: The high-performance and versatile I/O capabilities of the XC7K410T-L2FBG676E chip make it suitable for applications in the communications and networking domain. It can be used in the development of high-speed routers, switches, network interface cards, and other networking equipment.2. Aerospace and defense: The large capacity and advanced processing capabilities of this chip make it suitable for aerospace and defense applications. It can be used in radar systems, satellite communication systems, avionics, and other mission-critical applications that require high-performance computing and signal processing.3. High-performance computing: The XC7K410T-L2FBG676E chip can be used in high-performance computing applications that require parallel processing and high-speed data transfer. It can be used in areas such as scientific research, financial modeling, and data analytics.4. Industrial automation: The chip's high-performance capabilities and versatile I/O options make it suitable for industrial automation applications. It can be used in programmable logic controllers (PLCs), robotics, machine vision systems, and other industrial control systems.5. Medical imaging: The advanced DSP capabilities of the XC7K410T-L2FBG676E chip make it suitable for medical imaging applications, such as ultrasound, MRI, and CT scanners. It can efficiently process and analyze the large amounts of data generated by these imaging systems.These are just a few examples of the advantages and application scenarios of the XC7K410T-L2FBG676E chip. The versatility and high-performance capabilities of this chip make it suitable for a wide range of applications in various industries.