XC7K325T-1FF900I

XC7K325T-1FF900I

Manufacturer No:

XC7K325T-1FF900I

Manufacturer:

AMD

Description:

IC FPGA 500 I/O 900FCBGA

Datasheet:

Datasheet

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XC7K325T-1FF900I Specifications

  • Type
    Parameter
  • Supplier Device Package
    900-FCBGA (31x31)
  • Package / Case
    900-BBGA, FCBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.97V ~ 1.03V
  • Number of I/O
    500
  • Total RAM Bits
    16404480
  • Number of Logic Elements/Cells
    326080
  • Number of LABs/CLBs
    25475
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Kintex®-7
The XC7K325T-1FF900I is a specific model of the Xilinx Kintex-7 family of field-programmable gate array (FPGA) integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance FPGA: The Kintex-7 family is known for its high-performance capabilities, offering a balance between power efficiency and processing power. The XC7K325T-1FF900I chip is no exception and provides a significant amount of programmable logic resources and processing capabilities.2. Large capacity: The "325T" in the chip's name indicates that it has a large capacity, allowing for the implementation of complex designs and algorithms. This makes it suitable for applications that require a high level of computational power and memory.3. Versatility: The XC7K325T-1FF900I chip supports a wide range of I/O standards, making it compatible with various interfaces and protocols. This versatility enables its use in diverse applications.4. High-speed interfaces: The chip supports high-speed serial interfaces, such as PCIe (PCI Express) and Gigabit Ethernet, allowing for fast data transfer rates. This makes it suitable for applications that require high-speed communication and data processing.Application scenarios: 1. Communications and networking: The XC7K325T-1FF900I chip can be used in applications such as routers, switches, and network interface cards (NICs) due to its high-speed interfaces and large capacity. It can handle complex networking protocols and perform data processing tasks efficiently.2. High-performance computing: The chip's high-performance capabilities make it suitable for applications in the field of high-performance computing (HPC). It can be used in areas like scientific research, data analysis, and simulations, where significant computational power is required.3. Video and image processing: The XC7K325T-1FF900I chip's large capacity and high-speed interfaces make it well-suited for video and image processing applications. It can handle tasks like video encoding/decoding, image recognition, and real-time video processing.4. Industrial automation: The chip's versatility and high-performance features make it suitable for industrial automation applications. It can be used in programmable logic controllers (PLCs), robotics, and control systems, where real-time processing and high-speed I/O are essential.5. Aerospace and defense: The XC7K325T-1FF900I chip's capabilities make it suitable for aerospace and defense applications. It can be used in radar systems, signal processing, communication systems, and other applications that require high-performance computing and reliable operation in harsh environments.It's important to note that the specific application scenarios may vary depending on the requirements and design considerations of each project.