XC6VLX130T-L1FF784I

XC6VLX130T-L1FF784I

Manufacturer No:

XC6VLX130T-L1FF784I

Manufacturer:

AMD

Description:

IC FPGA 400 I/O 784FCBGA

Datasheet:

Datasheet

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XC6VLX130T-L1FF784I Specifications

  • Type
    Parameter
  • Supplier Device Package
    784-FCBGA (29x29)
  • Package / Case
    784-BBGA, FCBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.91V ~ 0.97V
  • Number of I/O
    400
  • Total RAM Bits
    9732096
  • Number of Logic Elements/Cells
    128000
  • Number of LABs/CLBs
    10000
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Virtex®-6 LXT
The XC6VLX130T-L1FF784I is a specific model of the Virtex-6 family of Field-Programmable Gate Array (FPGA) integrated circuit chips developed by Xilinx. These chips offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the XC6VLX130T-L1FF784I are:Advantages: 1. High Performance: The XC6VLX130T-L1FF784I chip provides high-performance processing capabilities, making it suitable for demanding applications that require fast data processing and complex algorithms. 2. Flexibility: Being an FPGA, the chip offers flexibility in terms of reconfigurability. Users can program and reprogram the chip to perform different functions, making it adaptable to changing requirements. 3. Parallel Processing: FPGAs excel at parallel processing tasks, allowing for efficient execution of multiple tasks simultaneously. This makes them suitable for applications that require high parallelism, such as image and signal processing. 4. Customization: FPGAs can be customized to implement specific functionalities and algorithms, enabling the development of application-specific solutions. This customization capability is particularly useful in domains like aerospace, defense, and telecommunications. 5. Integration: The XC6VLX130T-L1FF784I chip integrates various components, including configurable logic blocks, memory blocks, and input/output interfaces, reducing the need for external components and simplifying system design.Application Scenarios: 1. High-Performance Computing: The XC6VLX130T-L1FF784I chip's high-performance capabilities make it suitable for applications in the field of high-performance computing, such as scientific simulations, data analytics, and financial modeling. 2. Digital Signal Processing: FPGAs are widely used in digital signal processing applications, including audio and video processing, radar systems, and wireless communication. The XC6VLX130T-L1FF784I chip's parallel processing capabilities and high-speed interfaces make it well-suited for such applications. 3. Embedded Systems: FPGAs are often used in embedded systems to implement specific functionalities and interface with other components. The XC6VLX130T-L1FF784I chip's integration and reconfigurability make it suitable for embedded applications like industrial automation, robotics, and automotive systems. 4. Prototyping and Development: FPGAs are commonly used for rapid prototyping and development of new hardware designs. The XC6VLX130T-L1FF784I chip's flexibility and customization capabilities make it a valuable tool for hardware designers and engineers. 5. Aerospace and Defense: The XC6VLX130T-L1FF784I chip's high-performance processing, customization, and integration features make it suitable for aerospace and defense applications, including radar systems, avionics, and secure communications.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and constraints of the target system.