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XC6VLX130T-2FFG1156I Specifications
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TypeParameter
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Supplier Device Package1156-FCBGA (35x35)
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Package / Case1156-BBGA, FCBGA
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Operating Temperature-40°C ~ 100°C (TJ)
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Mounting TypeSurface Mount
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Voltage - Supply0.95V ~ 1.05V
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Number of I/O600
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Total RAM Bits9732096
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Number of Logic Elements/Cells128000
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Number of LABs/CLBs10000
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesVirtex®-6 LXT
The XC6VLX130T-2FFG1156I is a specific model of the Virtex-6 family of Field-Programmable Gate Array (FPGA) integrated circuit chips developed by Xilinx. Here are some advantages and application scenarios of this particular chip:Advantages: 1. High-performance FPGA: The XC6VLX130T-2FFG1156I chip offers high logic capacity, with 130,000 logic cells, making it suitable for complex and demanding applications. 2. Advanced processing capabilities: It features advanced DSP slices, which are optimized for digital signal processing tasks, enabling efficient implementation of algorithms like filtering, modulation, and demodulation. 3. Flexible and reprogrammable: Being an FPGA, the chip can be reprogrammed multiple times, allowing for flexibility in design iterations and updates without requiring hardware changes. 4. High-speed interfaces: The chip supports various high-speed interfaces like PCIe, Ethernet, and DDR3 memory, enabling seamless integration with other systems and devices. 5. Low power consumption: The XC6VLX130T-2FFG1156I chip is designed to be power-efficient, making it suitable for applications where power consumption is a concern.Application Scenarios: 1. Communications and Networking: The high logic capacity and support for high-speed interfaces make the XC6VLX130T-2FFG1156I chip suitable for applications like network routers, switches, and communication equipment. 2. Digital Signal Processing (DSP): The advanced DSP slices and high logic capacity make it ideal for implementing complex DSP algorithms in applications such as wireless communication systems, audio/video processing, and radar systems. 3. Industrial Automation: The chip's reprogrammability and high-performance capabilities make it suitable for industrial automation applications like robotics, machine vision, and control systems. 4. Aerospace and Defense: The XC6VLX130T-2FFG1156I chip's high logic capacity, low power consumption, and support for high-speed interfaces make it suitable for aerospace and defense applications, including avionics, radar systems, and secure communication systems. 5. High-Performance Computing: The chip's high logic capacity and support for high-speed interfaces make it suitable for applications in high-performance computing, such as data centers, scientific research, and simulations.It's important to note that the specific application scenarios may vary depending on the requirements and design considerations of the project.
