XC7K325T-3FBG676E

XC7K325T-3FBG676E

Manufacturer No:

XC7K325T-3FBG676E

Manufacturer:

AMD

Description:

IC FPGA 400 I/O 676FCBGA

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

XC7K325T-3FBG676E Specifications

  • Type
    Parameter
  • Number of Logic Elements/Cells
    326080
  • Supplier Device Package
    676-FCBGA (27x27)
  • Package / Case
    676-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.97V ~ 1.03V
  • Number of I/O
    400
  • Total RAM Bits
    16404480
  • Number of LABs/CLBs
    25475
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Kintex®-7
The XC7K325T-3FBG676E is a specific model of the Xilinx Kintex-7 family of field-programmable gate array (FPGA) integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance FPGA: The Kintex-7 family is known for its high-performance capabilities, offering a good balance between power consumption and performance. 2. Large capacity: The XC7K325T-3FBG676E chip has a large logic capacity, allowing for the implementation of complex digital designs. 3. Versatility: FPGAs are highly versatile and can be reprogrammed to perform different functions, making them suitable for a wide range of applications. 4. High-speed interfaces: The XC7K325T-3FBG676E chip supports various high-speed interfaces such as PCIe, DDR3, and Ethernet, enabling connectivity with other devices and systems. 5. Low power consumption: The Kintex-7 family is designed to be power-efficient, making it suitable for applications where power consumption is a concern.Application scenarios: 1. Communications: The XC7K325T-3FBG676E chip can be used in communication systems, such as wireless base stations, where high-speed data processing and connectivity are required. 2. Aerospace and defense: FPGAs are commonly used in aerospace and defense applications, such as radar systems, signal processing, and avionics, due to their high performance and reconfigurability. 3. Industrial automation: The chip can be utilized in industrial automation systems, including robotics, machine vision, and control systems, where real-time processing and high-speed interfaces are essential. 4. High-performance computing: The XC7K325T-3FBG676E chip can be employed in high-performance computing applications, such as data centers and scientific research, where parallel processing and high-speed data transfer are crucial. 5. Test and measurement: FPGAs are widely used in test and measurement equipment, such as oscilloscopes and logic analyzers, due to their ability to implement complex signal processing algorithms and high-speed data acquisition.It's important to note that the specific application scenarios may vary depending on the requirements and design considerations of a particular project.