XC6VLX130T-2FFG784I

XC6VLX130T-2FFG784I

Manufacturer No:

XC6VLX130T-2FFG784I

Manufacturer:

AMD

Description:

IC FPGA 400 I/O 784FCBGA

Datasheet:

Datasheet

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XC6VLX130T-2FFG784I Specifications

  • Type
    Parameter
  • Number of Logic Elements/Cells
    128000
  • Supplier Device Package
    784-FCBGA (29x29)
  • Package / Case
    784-BBGA, FCBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.95V ~ 1.05V
  • Number of I/O
    400
  • Total RAM Bits
    9732096
  • Number of LABs/CLBs
    10000
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Virtex®-6 LXT
The XC6VLX130T-2FFG784I is a specific model of integrated circuit (IC) chip from Xilinx, which belongs to the Virtex-6 family of Field-Programmable Gate Arrays (FPGAs). Here are some advantages and application scenarios of this particular chip:Advantages: 1. High Logic Density: The XC6VLX130T-2FFG784I chip offers a high logic capacity, allowing for the implementation of complex digital designs. It contains 130,000 logic cells, which can be configured and programmed as per the application requirements. 2. High-Speed Performance: This chip supports high-speed operation, making it suitable for applications that require fast data processing and real-time performance. 3. Flexible and Reconfigurable: Being an FPGA, the XC6VLX130T-2FFG784I chip is highly flexible and reconfigurable. It allows users to modify the functionality of the chip even after it has been manufactured, enabling rapid prototyping and design iterations. 4. Integrated Features: The chip incorporates various integrated features like built-in memory blocks, DSP slices, and high-speed serial transceivers, which enhance its capabilities and make it suitable for a wide range of applications.Application Scenarios: 1. Communications and Networking: The XC6VLX130T-2FFG784I chip can be used in networking equipment, such as routers, switches, and network interface cards (NICs), to handle high-speed data processing, packet routing, and protocol handling. 2. Digital Signal Processing (DSP): With its integrated DSP slices, this chip is well-suited for applications that involve digital signal processing, such as audio/video processing, image recognition, and software-defined radio. 3. High-Performance Computing: The high logic density and fast processing capabilities of the XC6VLX130T-2FFG784I chip make it suitable for high-performance computing applications, including scientific simulations, data analytics, and cryptography. 4. Industrial Automation: This chip can be used in industrial automation systems for tasks like control and monitoring of machinery, process control, and sensor interfacing. 5. Aerospace and Defense: The XC6VLX130T-2FFG784I chip's high-speed performance and reconfigurability make it suitable for aerospace and defense applications, including radar systems, avionics, and secure communication systems.It's important to note that the specific application scenarios may vary depending on the requirements and design choices made by the user.