XC7K325T-L2FBG900E

XC7K325T-L2FBG900E

Manufacturer No:

XC7K325T-L2FBG900E

Manufacturer:

AMD

Description:

IC FPGA 500 I/O 900FCBGA

Datasheet:

Datasheet

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XC7K325T-L2FBG900E Specifications

  • Type
    Parameter
  • Number of Logic Elements/Cells
    326080
  • Supplier Device Package
    900-FCBGA (31x31)
  • Package / Case
    900-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.97V ~ 1.03V
  • Number of I/O
    500
  • Total RAM Bits
    16404480
  • Number of LABs/CLBs
    25475
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Kintex®-7
The XC7K325T-L2FBG900E is a specific model of integrated circuit chip from Xilinx, which belongs to the Kintex-7 family of Field-Programmable Gate Arrays (FPGAs). Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance FPGA: The Kintex-7 family of FPGAs offers high-performance capabilities, making it suitable for demanding applications that require fast processing and high-speed data transfer. 2. Large logic capacity: The XC7K325T-L2FBG900E chip has a large logic capacity, allowing for the implementation of complex digital designs and algorithms. 3. Low power consumption: Despite its high performance, the Kintex-7 FPGAs are designed to be power-efficient, making them suitable for applications where power consumption is a concern. 4. Versatility: FPGAs are programmable devices, allowing for flexibility and adaptability in various applications. The XC7K325T-L2FBG900E chip can be reprogrammed to perform different functions, making it suitable for a wide range of applications.Application scenarios: 1. Communications and networking: The high-performance and low-latency capabilities of the XC7K325T-L2FBG900E chip make it suitable for applications in telecommunications, networking, and data centers. It can be used for tasks such as packet processing, encryption/decryption, and protocol conversion. 2. Aerospace and defense: FPGAs are commonly used in aerospace and defense applications due to their ability to handle complex algorithms and real-time processing. The XC7K325T-L2FBG900E chip can be used in radar systems, avionics, signal processing, and secure communications. 3. High-performance computing: FPGAs are increasingly being used in high-performance computing (HPC) applications to accelerate specific tasks. The XC7K325T-L2FBG900E chip can be used in areas such as scientific simulations, financial modeling, and data analytics. 4. Industrial automation: FPGAs are used in industrial automation for tasks such as control systems, machine vision, and robotics. The XC7K325T-L2FBG900E chip can be utilized in applications that require real-time control, high-speed data processing, and advanced algorithms. 5. Medical imaging: The high-performance capabilities of the XC7K325T-L2FBG900E chip make it suitable for medical imaging applications such as ultrasound, MRI, and CT scanners. It can handle the processing and manipulation of large amounts of image data in real-time.These are just a few examples of the advantages and application scenarios of the XC7K325T-L2FBG900E chip. The versatility and programmability of FPGAs make them applicable in various industries and domains.