XC7K325T-2FBG900I

XC7K325T-2FBG900I

Manufacturer No:

XC7K325T-2FBG900I

Manufacturer:

AMD

Description:

IC FPGA 500 I/O 900FCBGA

Datasheet:

Datasheet

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XC7K325T-2FBG900I Specifications

  • Type
    Parameter
  • Number of Logic Elements/Cells
    326080
  • Supplier Device Package
    900-FCBGA (31x31)
  • Package / Case
    900-BBGA, FCBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.97V ~ 1.03V
  • Number of I/O
    500
  • Total RAM Bits
    16404480
  • Number of LABs/CLBs
    25475
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Kintex®-7
The XC7K325T-2FBG900I is a specific model of integrated circuit (IC) chip from Xilinx, which belongs to the Kintex-7 family of FPGAs (Field-Programmable Gate Arrays). Here are some advantages and application scenarios of this particular chip:Advantages: 1. High Performance: The XC7K325T-2FBG900I chip offers high-performance processing capabilities, making it suitable for demanding applications that require fast and efficient data processing. 2. Programmability: Being an FPGA, this chip is highly programmable, allowing users to customize and reconfigure the hardware functionality according to their specific requirements. 3. Versatility: The XC7K325T-2FBG900I chip supports a wide range of applications due to its flexible architecture, making it suitable for various industries and domains. 4. Integration: This chip integrates multiple components and features, including programmable logic blocks, DSP slices, memory blocks, and high-speed I/O interfaces, providing a comprehensive solution in a single package.Application Scenarios: 1. Communications: The XC7K325T-2FBG900I chip can be used in communication systems, such as wireless base stations, routers, and network switches, to handle high-speed data processing, protocol conversion, and signal modulation/demodulation. 2. Aerospace and Defense: This chip is suitable for aerospace and defense applications, including radar systems, avionics, and military communication systems, where high-performance processing, real-time data handling, and secure communication are crucial. 3. Industrial Automation: The XC7K325T-2FBG900I chip can be utilized in industrial automation systems, such as robotics, machine vision, and control systems, to enable real-time data processing, sensor interfacing, and complex algorithm execution. 4. High-Performance Computing: This chip can be employed in high-performance computing applications, such as data centers and scientific research, to accelerate computationally intensive tasks, parallel processing, and data analytics.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and design considerations of a particular project.