XC6VLX130T-1FFG1156I

XC6VLX130T-1FFG1156I

Manufacturer No:

XC6VLX130T-1FFG1156I

Manufacturer:

AMD

Description:

IC FPGA 600 I/O 1156FCBGA

Datasheet:

Datasheet

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XC6VLX130T-1FFG1156I Specifications

  • Type
    Parameter
  • Number of Logic Elements/Cells
    128000
  • Supplier Device Package
    1156-FCBGA (35x35)
  • Package / Case
    1156-BBGA, FCBGA
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.95V ~ 1.05V
  • Number of I/O
    600
  • Total RAM Bits
    9732096
  • Number of LABs/CLBs
    10000
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Virtex®-6 LXT
The XC6VLX130T-1FFG1156I is a specific model of integrated circuit (IC) chip from Xilinx, which belongs to the Virtex-6 family of Field-Programmable Gate Arrays (FPGAs). Here are some advantages and application scenarios of this particular chip:Advantages: 1. High Logic Density: The XC6VLX130T-1FFG1156I chip offers a high logic capacity, allowing for the implementation of complex digital designs. It contains 130,000 logic cells, which can be configured and interconnected as per the application requirements.2. Flexible and Reconfigurable: FPGAs are known for their reconfigurability, and this chip is no exception. It allows users to modify the functionality of the chip even after it has been manufactured, making it suitable for prototyping and development purposes.3. High-Speed Performance: The XC6VLX130T-1FFG1156I chip supports high-speed interfaces and can operate at high clock frequencies. It offers advanced features like high-speed serial transceivers, which enable the implementation of high-bandwidth communication interfaces.4. On-Chip Memory: This chip includes various types of on-chip memory blocks, such as Block RAM (BRAM) and Distributed RAM (DRAM). These memory resources can be used to store data or implement complex memory structures within the FPGA itself, reducing the need for external memory components.Application Scenarios: 1. Digital Signal Processing (DSP): The XC6VLX130T-1FFG1156I chip can be used in applications that require high-performance DSP capabilities. Its high logic density and on-chip memory make it suitable for implementing complex algorithms used in areas like image processing, audio/video codecs, and wireless communication systems.2. High-Speed Communication: With its high-speed serial transceivers, this chip can be used in applications that require high-bandwidth communication interfaces. It can be utilized in networking equipment, data centers, or any system that needs to handle large amounts of data at high speeds.3. Industrial Automation: FPGAs find extensive use in industrial automation systems. The XC6VLX130T-1FFG1156I chip can be employed to implement control logic, interface with sensors and actuators, and perform real-time processing in applications like robotics, machine vision, and process control.4. Prototyping and Development: Due to its reconfigurability, the XC6VLX130T-1FFG1156I chip is often used for prototyping and development purposes. It allows designers to quickly iterate and test their designs before moving to a custom ASIC (Application-Specific Integrated Circuit) implementation.It's important to note that the specific application scenarios may vary depending on the requirements of the project and the capabilities of the chip.