A3PE3000L-1FGG896M

A3PE3000L-1FGG896M

Manufacturer No:

A3PE3000L-1FGG896M

Manufacturer:

Microchip Technology

Description:

IC FPGA 620 I/O 896FBGA

Datasheet:

Datasheet

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A3PE3000L-1FGG896M Specifications

  • Type
    Parameter
  • Supplier Device Package
    896-FBGA (31x31)
  • Package / Case
    896-BGA
  • Operating Temperature
    -55°C ~ 125°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.425V ~ 1.575V
  • Number of Gates
    3000000
  • Number of I/O
    620
  • Total RAM Bits
    516096
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    ProASIC3L
The A3PE3000L-1FGG896M is an integrated circuit chip from the A3P family of Actel ProASIC3 FPGAs. Here are some advantages and application scenarios of this chip:Advantages: 1. High-density FPGA: The A3PE3000L-1FGG896M offers a high logic density, allowing for the implementation of complex digital designs on a single chip. 2. Low power consumption: This chip is designed to be power-efficient, making it suitable for battery-powered or low-power applications. 3. Non-volatile configuration: The ProASIC3 FPGAs use flash memory technology for configuration, enabling the chip to retain its configuration even when power is removed. 4. High-performance features: The A3PE3000L-1FGG896M supports high-speed interfaces, such as DDR2/DDR3 memory interfaces, making it suitable for applications requiring fast data transfer.Application scenarios: 1. Communications: The high-density and high-performance features of the A3PE3000L-1FGG896M make it suitable for applications in the communications field, such as wireless base stations, network routers, and switches. 2. Industrial control: The chip's low power consumption and non-volatile configuration make it ideal for industrial control systems, such as programmable logic controllers (PLCs) and automation equipment. 3. Medical devices: The A3PE3000L-1FGG896M can be used in medical devices that require high-performance processing capabilities, such as medical imaging equipment or patient monitoring systems. 4. Aerospace and defense: The chip's reliability, low power consumption, and high-density features make it suitable for aerospace and defense applications, including avionics systems, radar systems, and secure communication systems.These are just a few examples of the advantages and application scenarios of the A3PE3000L-1FGG896M chip. The specific use cases may vary depending on the requirements of the application and the system design.