XCKU3P-L2SFVB784E

XCKU3P-L2SFVB784E

Manufacturer No:

XCKU3P-L2SFVB784E

Manufacturer:

AMD

Description:

IC FPGA 256 I/O 784FCBGA

Datasheet:

Datasheet

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XCKU3P-L2SFVB784E Specifications

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The XCKU3P-L2SFVB784E is a specific model of the Xilinx Kintex UltraScale+ family of integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance processing: The XCKU3P-L2SFVB784E chip offers high-performance processing capabilities, making it suitable for demanding applications that require significant computational power. 2. Versatility: It provides a wide range of programmable logic resources, including configurable logic blocks (CLBs), digital signal processing (DSP) slices, and memory blocks, allowing for flexible implementation of various functions. 3. High-speed interfaces: The chip supports high-speed interfaces like PCIe Gen3, 100G Ethernet, and DDR4 memory interfaces, enabling fast data transfer and communication. 4. Low power consumption: Despite its high performance, the chip is designed to be power-efficient, making it suitable for applications where power consumption is a concern. 5. Scalability: The Kintex UltraScale+ family offers different chip models with varying resources, allowing for scalability based on the specific requirements of the application.Application Scenarios: 1. Data centers: The high-performance processing capabilities and support for high-speed interfaces make the XCKU3P-L2SFVB784E chip suitable for data center applications, such as network acceleration, machine learning, and data analytics. 2. High-performance computing: It can be used in applications that require significant computational power, such as scientific simulations, financial modeling, and image processing. 3. Communications and networking: The chip's support for high-speed interfaces like PCIe and Ethernet makes it suitable for applications in the telecommunications and networking domains, including routers, switches, and network interface cards. 4. Aerospace and defense: The XCKU3P-L2SFVB784E chip's high-performance processing and low power consumption make it suitable for aerospace and defense applications, such as radar systems, signal processing, and secure communications. 5. Industrial automation: It can be used in industrial automation applications, including robotics, machine vision, and control systems, where high-performance processing and low latency are required.These are just a few examples, and the versatility of the XCKU3P-L2SFVB784E chip allows it to be applied in various other domains where high-performance processing and programmability are essential.