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XC7K325T-1FB676I Specifications
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TypeParameter
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Supplier Device Package676-FCBGA (27x27)
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Package / Case676-BBGA, FCBGA
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Operating Temperature-40°C ~ 100°C (TJ)
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Mounting TypeSurface Mount
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Voltage - Supply0.97V ~ 1.03V
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Number of I/O400
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Total RAM Bits16404480
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Number of Logic Elements/Cells326080
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Number of LABs/CLBs25475
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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SeriesKintex®-7
The XC7K325T-1FB676I is a specific model of the Xilinx Kintex-7 family of field-programmable gate array (FPGA) integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance FPGA: The Kintex-7 family is known for its high-performance capabilities, offering a balance between power efficiency and processing power. The XC7K325T-1FB676I chip is no exception, providing a high-performance FPGA solution for various applications.2. Large logic capacity: The "325" in the chip's name indicates that it has a logic capacity of 325,000 logic cells. This allows for the implementation of complex digital designs and algorithms.3. Versatile I/O capabilities: The XC7K325T-1FB676I chip offers a wide range of I/O options, including high-speed serial transceivers, general-purpose I/O pins, and memory interfaces. This versatility enables connectivity with various external devices and subsystems.4. Advanced DSP capabilities: The Kintex-7 family incorporates dedicated digital signal processing (DSP) blocks, which are optimized for performing complex mathematical operations efficiently. This makes the XC7K325T-1FB676I chip suitable for applications requiring signal processing, such as wireless communication systems, image processing, and software-defined radios.Application scenarios: 1. Communications systems: The high-performance FPGA and DSP capabilities of the XC7K325T-1FB676I chip make it suitable for applications in wireless communication systems, including base stations, wireless infrastructure, and software-defined radios.2. Aerospace and defense: The chip's large logic capacity and versatile I/O options make it well-suited for aerospace and defense applications. It can be used in radar systems, avionics, satellite communication, and military-grade equipment.3. High-performance computing: The XC7K325T-1FB676I chip can be utilized in high-performance computing applications, such as data centers, supercomputers, and scientific research, where parallel processing and high-speed data transfer are crucial.4. Industrial automation: The chip's capabilities make it suitable for industrial automation applications, including robotics, machine vision, and control systems. Its high-performance FPGA can handle complex control algorithms and interface with various sensors and actuators.5. Medical imaging: The XC7K325T-1FB676I chip's DSP capabilities and high-speed serial transceivers make it suitable for medical imaging applications, such as ultrasound, MRI, and CT scanners, where real-time signal processing and high-speed data transfer are essential.These are just a few examples of the advantages and application scenarios of the XC7K325T-1FB676I chip. Its versatility and high-performance capabilities make it suitable for a wide range of applications in various industries.
