XC7K325T-L2FBG676E

XC7K325T-L2FBG676E

Manufacturer No:

XC7K325T-L2FBG676E

Manufacturer:

AMD

Description:

IC FPGA 400 I/O 676FCBGA

Datasheet:

Datasheet

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XC7K325T-L2FBG676E Specifications

  • Type
    Parameter
  • Supplier Device Package
    676-FCBGA (27x27)
  • Package / Case
    676-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 100°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.97V ~ 1.03V
  • Number of I/O
    400
  • Total RAM Bits
    16404480
  • Number of Logic Elements/Cells
    326080
  • Number of LABs/CLBs
    25475
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Kintex®-7
The XC7K325T-L2FBG676E is a specific model of the Xilinx Kintex-7 family of field-programmable gate array (FPGA) integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance FPGA: The Kintex-7 family is known for its high-performance capabilities, offering a balance between power efficiency and processing power. The XC7K325T-L2FBG676E chip is no exception, providing a significant amount of logic resources and high-speed I/O interfaces. 2. Large logic capacity: With 325,000 logic cells, this chip can handle complex digital designs and algorithms. It also offers a wide range of built-in resources like DSP slices, memory blocks, and high-speed transceivers. 3. High-speed interfaces: The XC7K325T-L2FBG676E chip supports various high-speed interfaces such as PCIe, Ethernet, USB, and DDR3 memory interfaces. This makes it suitable for applications requiring fast data transfer and communication. 4. Flexibility and reconfigurability: Being an FPGA, the chip can be reprogrammed to implement different functionalities and adapt to changing requirements. This flexibility is advantageous in scenarios where the design needs to be modified or upgraded without changing the hardware.Application scenarios: 1. Communications and networking: The XC7K325T-L2FBG676E chip's high-speed interfaces and processing power make it suitable for applications in telecommunications, networking, and data centers. It can be used for tasks like packet processing, protocol conversion, encryption/decryption, and network acceleration. 2. High-performance computing: The chip's large logic capacity and high-speed interfaces make it suitable for accelerating computationally intensive tasks. It can be used in applications like scientific computing, image processing, and machine learning, where parallel processing and high-speed data transfer are crucial. 3. Industrial automation: The XC7K325T-L2FBG676E chip can be used in industrial automation systems for tasks like real-time control, sensor interfacing, and data processing. Its reconfigurability allows for customization and adaptation to different automation requirements. 4. Aerospace and defense: The chip's high-performance capabilities and reliability make it suitable for aerospace and defense applications. It can be used in radar systems, signal processing, avionics, and secure communication systems.These are just a few examples of the advantages and application scenarios of the XC7K325T-L2FBG676E chip. The versatility and performance of this FPGA make it applicable in various domains where high-speed processing, flexibility, and reconfigurability are required.