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XC6VLX130T-L1FFG1156C

XC6VLX130T-L1FFG1156C

Manufacturer No:

XC6VLX130T-L1FFG1156C

Manufacturer:

AMD

Description:

IC FPGA 600 I/O 1156FCBGA

Datasheet:

Datasheet

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XC6VLX130T-L1FFG1156C Specifications

  • Type
    Parameter
  • Supplier Device Package
    1156-FCBGA (35x35)
  • Package / Case
    1156-BBGA, FCBGA
  • Operating Temperature
    0°C ~ 85°C (TJ)
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    0.87V ~ 0.93V
  • Number of I/O
    600
  • Total RAM Bits
    9732096
  • Number of Logic Elements/Cells
    128000
  • Number of LABs/CLBs
    10000
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Virtex®-6 LXT
The XC6VLX130T-L1FFG1156C is a specific model of the Virtex-6 family of Field-Programmable Gate Array (FPGA) integrated circuit chips developed by Xilinx. Here are some advantages and application scenarios of this particular chip:Advantages: 1. High-performance FPGA: The XC6VLX130T-L1FFG1156C offers a high logic density and performance capabilities, making it suitable for complex and demanding applications. 2. Large capacity: With a capacity of 131,200 logic cells, this chip provides ample resources for implementing complex digital designs. 3. Versatile I/O capabilities: The chip offers a wide range of I/O options, including high-speed serial interfaces, making it suitable for applications requiring high-speed data transfer. 4. Advanced DSP capabilities: The Virtex-6 family includes dedicated Digital Signal Processing (DSP) slices, enabling efficient implementation of signal processing algorithms. 5. Low power consumption: The XC6VLX130T-L1FFG1156C incorporates power-saving features, allowing for efficient operation and reduced energy consumption.Application Scenarios: 1. Communications and Networking: The high-performance and versatile I/O capabilities of the XC6VLX130T-L1FFG1156C make it suitable for applications such as network routers, switches, and high-speed data communication systems. 2. Aerospace and Defense: The large capacity and advanced DSP capabilities of the chip make it ideal for implementing complex algorithms used in radar systems, satellite communication, and military-grade signal processing applications. 3. High-Performance Computing: The XC6VLX130T-L1FFG1156C can be used in applications requiring high computational power, such as scientific simulations, data analytics, and image processing. 4. Industrial Automation: The chip's high logic density and versatile I/O options make it suitable for implementing control systems, robotics, and machine vision applications in industrial automation. 5. Medical Imaging: The advanced DSP capabilities of the XC6VLX130T-L1FFG1156C can be utilized in medical imaging systems, such as ultrasound, MRI, and CT scanners, for real-time signal processing and image reconstruction.It's important to note that the specific application scenarios may vary depending on the requirements and design considerations of each project.
XC6VLX130T-L1FFG1156C Relevant information